Signal Integrity

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In order to study what is needed and what has been adopted for the next Ethernet speed node of 200 Gbps per lane, this DesignCon 2024 paper, a recipient of the Best Paper Award, investigates different FEC schemes such as end-end, concatenated, and segmented FECs, examining how these different FEC schemes affect signal integrity and performance in different end applications. 

Anritsu Company enhances its Signal Quality Analyzer-R MP1900A to support the latest USB4 Version 2.0 (USB v2) communication standard of 80 Gbit/s data transmission speed.

VIAVI announces the first solution to address testing and validation needs of the emerging 1.6 Tb/s ecosystem based on 224G SERDES.

This DesignCon 2024 paper, a Best Paper Award winner, introduces a new process utilizing heuristics to determine laminate anisotropy based on Dk/Df construction tables provided by laminate suppliers.

Teledyne LeCroy’s QSPI TD option offers a user-friendly interface with extensive trigger options, providing broad coverage of the numerous SPI variants

Signal Edge Solutions announces that it is now a member of the IBIS Open Forum.

This DesignCon paper showcases high-speed design and testing schemes for LPO systems from a system perspective while also presenting the testing results, data, and product architecture of a linear direct-drive switch in conjunction with an LPO module system.

Designed for testing Ethernet and IP speeds up to 100 Gbps, PacketExpert 100G is ideal for evaluating high-speed backhaul networks and data center interconnects.

In this blog, John D'Ambrosia discusses the industry's approach to Ethernet in the age of AI, from the IEEE P802.3dj project to the efforts of the Ultra Ethernet Consortium to deliver a complete cost-effective Ethernet architecture optimized and scalable for high-performance AI. Read on to understand the role of these two complementary efforts to support AI workloads and gain insight into potential industry growth.

IDTechEx’s latest report, "Co-Packaged Optics 2025-2035: Technologies, Market, and Forecasts", explores advancements in CPO technology and packaging techniques enabling its adoption.