Signal Integrity

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In this article, power rail voltage measurement uncertainty is examined using several different probe configurations to monitor VCore measurements on a Picotest S2000 load stepper board. The results reveal measurement variations up to 27 mV — a level of uncertainty that can completely mask the performance improvements engineers are seeking from advanced VRM technologies. Read on to learn how engineers can trust their measurements when the uncertainty exceeds the performance gains they are trying to validate.

The 800G-ZR+ optics mark the next leap forward in network technology: double the data performance, higher efficiency, and lower energy consumption.

Anritsu Company has launched the MN4765B-0140 O/E Reference Calibration Module, the world’s fastest and first traceable solution to support the testing demands of next-generation data centers and the explosive growth of AI and ML.

This article discusses electrical and thermal co-simulation of multi-pin interconnects. Using Ansys Q3D and Icepak (2025R1), it highlights key practices such as parametrization, matrix reduction, and mesh settings to ensure accurate and efficient results with complex geometries.

AcceleRate HD slim, high-density array connectors now available with 16 mm stack heights and up to 400 total positions.

S-parameter data can reveal more than what it initially shows. This article presents four key insights that can be derived from your S-parameters, enabling smarter simulation and improving your signal integrity intuition.

While the lossless characteristics of superconducting interconnect can trigger visions of tremendous bandwidths over infinite physical distances, superconductors have unique properties that can appreciably affect signal integrity in unexpected ways. This article introduces kinetic inductance from the eyes of signal integrity with the aim of preparing engineers to analyze superconducting links.

This article introduces a hardware-centric definition of compute cluster bisection bandwidth as a performance metric for AI-scale 448 Gbps systems. Unlike traditional abstractions, this metric is grounded in physical interconnect layout and IO port availability, enabling system architects to evaluate bandwidth provisioning through real, bidirectional link paths.

Samtec announces the expansion of its AcceleRate® HP product line with the release of 800-position APM6 and APF6 high-performance array connectors available in a low-profile 5 mm stack height.