Signal Integrity

Figure 7

Sources and Compensation of Skew in Single-Ended and Differential Interconnects

VNA measurements showed that the board-to-board skew distribution of realistic board topologies/routes can be broad, and the peak measured skew was quite significant. Post processing of TDR data suggested that long routes parallel to the board edge may be particularly susceptible to skew variation due to the glass weave.
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RF Module

Ten Tips for Best Board Design Practices for IoT Applications

This design guide focuses on small form factor and low power IoT products. Even though these sorts of products are not in the same performance class as server motherboards, not paying attention to signal and power integrity design principles at the beginning of the design cycle may require multiple board spins to get your IoT product working.


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Better, Faster_Thumb_Rev

BER- and COM-Way of Channel-Compliance Evaluation: What are the Sources of Differences?

We analyze the computational procedure specified for Channel Operation Margin (COM) and compare it to traditional statistical eye/BER analysis. There are a number of differences between the two approaches, ranging from how they perform channel characterization, to how they consider Tx and Rx noise and apply termination, to the differences between numerical procedures employed to convert given jitter and crosstalk responses into the vertical distribution characterizing eye diagrams and BER. We show that depending on the channel COM may potentially overestimate the effect of crosstalk and, depending on a number of factors, over- or underestimate the effect of transmit jitter, especially when the channel operates at the rate limits. We propose a modification to the COM procedure that eliminates these problems without considerable work increase.


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PCIeImage

Ensuring High Signal Quality in PCIe Gen3 Channels

The increased data rates of today’s high-speed Input/Output (I/O) buses make maintaining transmission channel signal quality all the more challenging. One reason for the challenge is the parasitic effects that result from bus interconnects. Over the past decade, data rates for electrical interconnects have experienced a dramatic increase—from 1 Gbps to 25 Gbps and beyond—to meet the ever increasing demand for more I/O bandwidth from modern networking applications and high-capacity storage.


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IEEE P370 Plug and Play Test Coupons boards

IEEE P370 Working Group Update

The IEEE P370 Working Group is focused on improving high-speed PCB measurements, specifically their project is the “Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz.” If you weren’t able to make the IEEE P370 working group briefing at DesignCon 2017, here’s a summary of what was discussed.
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Cover image

A Practical Method to Model Effective Permittivity and Phase Delay Due to Conductor Surface Roughness

Presented at DesignCon 2017

In the GB/s regime, accurate modeling of conductor loss and phase delay is a precursor to successful high-speed serial link designs. In this paper, a practical method to model effective permittivity and phase delay, due to conductor surface roughness, is presented. By obtaining the dielectric and roughness parameters, solely from manufacturers’ data sheets, phase delay and effective permittivity can now be easily predicted. Detailed case studies and several examples test the model`s accuracy.


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