Ajay Thumma, Samtec

Ajay Thumma is an undergraduate at the University of Massachusetts Amherst, majoring in Electrical Engineering. Since July 2025, he has been working as a Signal and Power Integrity Co-Op at Samtec. His role at Samtec revolves around working with 3D wave solvers to help provide correct analysis and physical measurement of connector models.

Power Integrity Correlation of Ultra-Low-Impedance Via-Field Measurements

November 2, 2026

Ajay Thumma, Samtec

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Ultra-low-impedance power distribution network (PDN) structures are difficult to correlate because the impedance of the device under test (DUT) can be comparable to artifacts introduced by probe coupling, probe landing, reference-plane placement, and electromagnetic solver configuration settings. This article shows some possible full-wave 3D simulation workflows for the IEEE TC-EDMS Benchmark Problem V, a four-via test case on 1 mm pitch in which the vias are shorted together on the L2 plane.

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