Congratulations to Lambert (Bert) Simonovich on the publication of his new book!
We are delighted to share some exciting news with the Signal and Power Integrity engineering community. Longtime industry expert and respected contributor Bert Simonovich has published his new book, BERT SIMONOVICH’s SIGNAL & POWER INTEGRITY DESIGN NOTES: The Impact of PCB Fabrication and Material Properties on High-Speed Interconnect Modeling and Validation.
Drawing on more than 50 years of engineering experience, Bert explores the critical relationship between PCB fabrication, material properties, and high-speed interconnect performance. The book offers practical insights into copper roughness, dielectric anisotropy, fiber weave effects, field-solver modeling, and simulation-to-measurement correlation.
Combining fundamental physics with real-world engineering lessons, this new reference promises to be a valuable resource for both emerging and experienced SI/PI professionals.
Please join us in congratulating Bert on this outstanding milestone and his continued contributions to our engineering community!
Learn more and explore the book: