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As a gold sponsor, Rohde & Schwarz provides test equipment to the HORYZN and LEVITUM student initiatives of the Technical University of Munich (TUM) to help with drone development. 

Troubleshooting ESD in a compliance test lab can be time-consuming and expensive. Kenneth Wyatt provides practical advice on how to move the ESD troubleshooting process to your own workbench using simple ESD generators, simulators, and detectors. 

The vehicles of the future will be automated and networked to drive autonomously in road traffic and to relieve the drive, creating demand for new vehicle architectures and high-performance components.

PicoScope 7 boasts a range of enhanced features and functionality, making it the ideal choice for engineers and technicians looking for precise, reliable tools for their test and measurement needs.

Flex Power Modules has added a new part to their popular BMR492 series which now features a wide 36-75 V input range for telecom/PoE applications. 

In this article, Kella Knack outlines the stackup process, highlighting the importance of taking material issues, structural issues, and performance factors into account from the beginning of the design process. Knack discusses how providing fabricators with proper design documentation that includes precise information enables them to build to specification, ensuring correct functionality while avoiding additional costs for design.

Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE IEDM has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

Flex Power Modules and Bear VAI Technology are coming together to offer and support the Flex Power Modules range of DC/DC conversion products in the Midwest U.S.

The increasing demand for data processing is the primary driving force behind the growth in four key application areas. However, each application has specific requirements that necessitate different advanced semiconductor packaging technologies.