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Aaronia AG will be presenting groundbreaking solutions for spectrum analysis and EMC measurements at this year's EMC in Shanghai. 

This paper, awarded the Best Paper Award at DesignCon 2024, explores what is meant by bandwidth during the standardization process, the implications of test and verification attached to certain bandwidth requirements, as well as differences between acquisition range, band limited filters, and s-parameters for time domain processing. 

Infineon launches the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high-performance AI data centers.

By combining their advanced simulation, software model development, and validation techniques, Modelithics and SES will collaborate to address critical challenges faced by high-speed electronic and power electronic systems designers.

ZTE Corporation has announced the successful completion of the world's first live test of 1.2 Tbps single wavelength transmission utilizing 800GE client interface in collaboration with Turkcell on Bursa commercial network.

Terecircuits Corporation has introduced Terefilm, a patented material designed for temporary bonding and debonding applications in advanced packaging.

 IDTechEx highlights key findings from its report on the integration of EICs and PICs.

This DesignCon 2024 paper, a Best Paper Award winner, introduces a new process utilizing heuristics to determine laminate anisotropy based on Dk/Df construction tables provided by laminate suppliers.

OMRON Electronic Components is excited to announce its participation in the upcoming RE+ 24, the largest clean energy event in North America. 

According to a recently published report from Dell’Oro Group, the optical transport equipment market declined 19% year-over-year in 2Q 2024 due to an ongoing market correction caused by excess customer inventory, delays in new project starts in Asia Pacific, and weak macroeconomic conditions.