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Menlo Micro welcomed Under Secretary of Defense for Research and Engineering Heidi Shyu to Menlo Micro’s headquarters to discuss the widespread applications of its technology and the company’s continued work with the Department of Defense (DOD).
In this article, Steve Sandler presents several methods of measuring battery impedance, discussing the reasons for conducting such measurements and the challenges one might encounter along the way.
Available now in production quantities, Samtec AcceleRate Slim Direct-Attach Cable Assemblies target high-density applications in computing, datacom, AI, and shielded Gigabit Ethernet designs.
Cadence has achieved a significant milestone by designing and taping out its first-ever system chiplet, marking a groundbreaking advancement in chiplet realization capabilities.
Latest release combines Xpedition, Hyperlynx, and PADS Professional software through unified user experience with cloud connectivity and collaboration.
SLH/TLH PCB board-to-board connectors are part of Samtec’s Ultra Micro line of products that maximize overall space and offer reliable connections in high data rate rugged environments such as automotive, industrial IOT, robotics, and military and aerospace.
Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 μm and a diameter of 300 mm, in a high-scale semiconductor fab.
Vicor Corporation has released three automotive-grade power modules for 48V EV systems that deliver industry-leading power density and will support automotive OEM and tier one production in 2025.
Used exclusively for power transmission, Würth Elektronik's new USB socket supports the USB-PD communication protocol for adaptive charging up to 240 W.
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