Industry News

SI, PI and EMC/EMI related industry news items


Tektronix Delivers More Speed & Lowest Noise with 6 Series MSO Mixed Signal Oscilloscope

The First Midrange Scope with 8 GHz Bandwidth and 25 GS/s Sample Rate Simultaneously on all 4 Channels

Tektronix, Inc., today introduced the 6 Series MSO mixed signal oscilloscope. The new oscilloscope extends the performance threshold of midrange oscilloscopes to 8 GHz and delivers a 25 GS/s sample rate simultaneously on all 4 channels – an industry first for this class of oscilloscope – to accommodate the needs of designers working on faster, more complex embedded systems designs.

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New M12 Cable Assemblies from TE Connectivity Enable Rapid Implementation of High-speed Data Networks

Rugged cable assemblies ideal for rail, transportation and heavy industrial applications

TE Connectivity (TE), has extended its modular twisted pair cable assembly offering with new M12 cable assemblies. Conforming to EN45545 HL3 with fire and smoke characteristics, TE’s M12 cable assemblies are suitable for public transportation and other heavy industrial applications. Their rugged design enables them to withstand the vibrations experienced in trains and other demanding environments.

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PASSIVE PLUS, INC. Broadband Ceramic Capacitors: 01005BB 16 kHz to > 67 GHz Smallest on the Market

Passive Plus Inc. has the 01005BB104 broadband 100nF multilayer ceramic capacitors. The 01005BB104 – the smallest 100nF broadband part characterized for RF performance -- has a case measuring (mils) 16 x 8 x 8, and offers resonant-free RF coupling/DC blocking from 16 kHz (lower 3-dB frequency) to beyond 65 GHz with < 1 dB insertion loss and < -15 dB return loss on suitable substrates.

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TE Connectivity introduces Extra Large Array (XLA) Socket Technology for Next-Gen Data Centers

Solution offers superior warpage control and enables faster data rates

TE Connectivity (TE), today introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78 percent better warpage control than traditional molded socket technologies. The XLA socket technology allows TE to design enhanced sockets to support high data speeds in next-generation data centers.

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Dialog Semiconductor Simplifies IoT Cloud Connectivity with Latest Bluetooth® Low Energy Sensor Development Kit

SmartBond™ 15 Degrees-of-Freedom Multi-Sensor Kit advances IoT connectivity to the cloud, enabling wide device compatibility with the lowest power consumption

Dialog Semiconductor plc, today unveiled its new 15 Degrees-of-Freedom (DOF) SmartBond Multi-Sensor Kit to support sensor connectivity in the Internet of Things (IoT). Built on Dialog’s DA14585 SmartBond System-on-Chip (SoC), the kit allows engineers to easily connect sensors to the cloud at the lowest power and smallest footprint.

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