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Passive Plus, Inc. (PPI) has developed a series of Broadband Capacitors available in 4 different case sizes: 01005BB, 0201BB, 0402BB, and 0805BB. Values available are 10nF (10,000 pF) and 100nF (100,000 pF).

Tektronix, Inc., today introduced the 6 Series MSO mixed signal oscilloscope. The new oscilloscope extends the performance threshold of midrange oscilloscopes to 8 GHz and delivers a 25 GS/s sample rate simultaneously on all 4 channels – an industry first for this class of oscilloscope – to accommodate the needs of designers working on faster, more complex embedded systems designs.

TE Connectivity (TE), has extended its modular twisted pair cable assembly offering with new M12 cable assemblies. Conforming to EN45545 HL3 with fire and smoke characteristics, TE’s M12 cable assemblies are suitable for public transportation and other heavy industrial applications. Their rugged design enables them to withstand the vibrations experienced in trains and other demanding environments.

TE Connectivity (TE) is pleased to announce it has partnered with Annapolis Micro Systems, a leading FPGA board and systems supplier, on the release of three of their new high-performance FPGA boards that feature TE’s NanoRF module.

Passive Plus Inc. has the 01005BB104 broadband 100nF multilayer ceramic capacitors. The 01005BB104 – the smallest 100nF broadband part characterized for RF performance -- has a case measuring (mils) 16 x 8 x 8, and offers resonant-free RF coupling/DC blocking from 16 kHz (lower 3-dB frequency) to beyond 65 GHz with < 1 dB insertion loss and < -15 dB return loss on suitable substrates.

TE Connectivity (TE), today introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78 percent better warpage control than traditional molded socket technologies. The XLA socket technology allows TE to design enhanced sockets to support high data speeds in next-generation data centers.

Dialog Semiconductor plc, today unveiled its new 15 Degrees-of-Freedom (DOF) SmartBond Multi-Sensor Kit to support sensor connectivity in the Internet of Things (IoT). Built on Dialog’s DA14585 SmartBond System-on-Chip (SoC), the kit allows engineers to easily connect sensors to the cloud at the lowest power and smallest footprint.