Industry News

RSS

Ultra-low-impedance power distribution network (PDN) structures are difficult to correlate because the impedance of the device under test (DUT) can be comparable to artifacts introduced by probe coupling, probe landing, reference-plane placement, and electromagnetic solver configuration settings. This article shows some possible full-wave 3D simulation workflows for the IEEE TC-EDMS Benchmark Problem V, a four-via test case on 1 mm pitch in which the vias are shorted together on the L2 plane.  

PCI Express® is accelerating to meet AI and hyperscale infrastructure demand. PCIe 7.0 reached Base Specification release in June 2025, defining performance at the ASIC pins, and the Peripheral Component Interconnect Special Interest Group (PCI-SIG) Board also announced direction pushing PCIe to 256 GT/s, signaling an accelerated roadmap beyond PCIe 7.0 128 GT/s, and reinforcing a faster standards cadence than prior generations.

Modern AI and datacenter systems, equipped with complex multi-domain Power Distribution Networks (PDNs), grapple with substantial challenges stemming from large-signal crosstalk and ground bounce.

Traditional space LDOs rely on silicon MOSFETs that suffer from radiation degradation. To solve this, Tony Marini from EPC Space highlights a revolutionary alternative using enhancement-mode Gallium Nitride (eGaN) HEMTs. Their unique material physics inherently resists Total Ionizing Dose (TID) effects without performance loss, ensuring exceptional parameter stability in harsh orbital environments.

According to Growth Market Report, the global Signal Integrity Monitoring for Vehicles market size reached USD 2.00 billion in 2025, driven by rapid advancements in automotive electronics and the increasing complexity of vehicle communication networks.

Signal Integrity Journal is pleased to welcome Benoit Derat as its newest Technical Advisor.

The rapid growth in Data Centers, AI, and supercomputing demands significantly faster edge rates at the package and PCB levels, necessitating superior power delivery network (PDN) solutions.

The global optical I/O for AI chips market was valued at USD 1.1 billion in 2025 and is estimated to grow at a CAGR of 27.8% to reach USD 14 billion by 2035, according to recent report by Global Market Insights Inc.

Molex, a global electronics leader and connectivity innovator, introduced VersaBeam Mini, an ultra-compact, 16-fiber Expanded Beam Optical (EBO) connector that solves critical space, thermal and maintenance challenges in high-density AI and hyperscale networks.