EDI CON China 2020 will provide a forum for engineers to share their expertise and discuss new design methodologies with colleagues during this year’s conference. Attendees will also have the opportunity to see award-winning products and talk with industry-leading vendors at the adjacent exhibition on May 12-13, 2020 at the China National Convention Center (CNCC) in Beijing, China. Now in its eighth year, EDI CON China continues to be the largest microwave and high speed digital design conference and exhibition in China.
The technical sessions and panels will be organized around tracks focused on 5G, test & measurement, radar/communications, amplifiers, RF/microwave, measurement and modeling, signal integrity and power integrity.
EDI CON technical sessions are educational, providing information on how to address design challenges using available materials, tools, products and techniques. The 30-minute sessions held May 12-13, 2020 are based on peer-reviewed abstracts and papers that have been evaluated by the EDI CON Technical Advisory Committee. To participate, submit a detailed abstract for consideration by January 6.
Abstracts are judged based on quality, relevance, impact and originality. Good examples of abstracts include ones that report on important results, methodologies or case studies. It is acceptable to reference products in a design case study or as a proof of concept for a design methodology, but advertising and product promotion is not acceptable in session proposals.
More information, including instructions on how to submit an abstract and an application to exhibit, is available at www.ediconchina.com.