Solder Chemistry will feature two of its proven solder paste solutions at SMTConnect, May 10-12 in Nuremberg, Germany.

Solder Chemistry’s BLF083 is a lead-free, no-clean paste designed for excellent soldering results with a wide range of process conditions. BLF083 offers outstanding low-voiding, slump, and solder beading resistance, as well as high-temperature stability, long-term processing and standing time. BLF083 paste delivers:

  • Low-voiding performance
  • Excellent low-to-medium-speed printing
  • High tackiness 
  • Good response-to-pause
  • Low beading
  • Clear residue
  • Easy cleanability 

BLF04 is a lead-free, no-clean solder paste that is a good fit for automotive applications due to its ultra-low-voiding, enhanced surface insulation resistance, and void-free solder joints. BLF04 also offers:

  • Excellent high-speed printing
  • Good tackiness and excellent wetting
  • Excellent response-to-pause with good open time
  • Low beading
  • Pale yellow residue
  • Easy solvent cleanability

BLF083 and BLF04 are supported by Solder Chemistry’s cored wire, flux, rework materials, and SMT adhesives. To learn more about its solder solutions, visit the company in Hall 5, Booth 320 at SMTConnect.