Items Tagged with 'modeling'

In the future, the complexity of circuit implementation will increase dramatically and modeling of high-speed SerDes systems will continue to be a huge challenge. Modeling equalization circuit characteristics has become extremely important to ensure the success of the final platform implementation and provide a strong signal integrity design guide. This paper reviews the common challenges of converting an existing detailed architectural model to an IBIS-AMI model and some of the ways to address these challenges. It also includes an illustration of the workflow to model Intel’s 56G PAM4 SerDes.

When starting a new project, board designers are often overwhelmed when trying to choose appropriate diff pair geometry, board material, and stackup to meet high-speed serial link loss budgets. Part of the printed circuit board (PCB) interconnect challenge is modeling transmission lines accurately. 

SIJ had the opportunity to engage with Larry Williams, ANSYS director of technology, to find out his thoughts on how modeling and simulation needs have changed, how the industry has responded, and what’s next. At ANSYS, Larry Williams is responsible for the strategic direction of the company’s physics simulation products.

In high-speed digital channel design, vias are everywhere and are becoming very crucial elements to the channel performance. Especially with the higher data rate requirements in mobile, networking, and data center applications, the effect of vias in a design is very noticeable. Design engineers have traditionally used time domain reflectometry (TDR) as a tool to characterize and optimize via designs, yet the TDR approach comes with shortcomings such as demanding shorter rise-time step signal or larger bandwidth S-parameters, and inaccurate read-out on the via impedance.

In this article, we propose a simple and effective Z-input impedance method that augments the traditional TDR method for characterizing and optimizing via designs in much faster speed systems.