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Stefaan Sercu, Samtec Signal Integrity R&D Engineer, recently presented “Impedance Corrected De-Embedding,” which discussed the advantages of impedance corrected de-embedding over standard 2X through de-embedding, here are some highlights of his talk.

There is an unsatisfied thirst by professional engineers to play with tools that give them a taste of the pro-level tools. Eric Bogatin makes his argument for low cost or “student level” equipment from tool vendors.

Recently, Ansys released its HFSS Mesh Fusion product for simulation of complex EM systems. Signal Integrity Journal (SIJ) followed up with Dr. Matthew Commens, Principal Product Manager, HF at Ansys, Inc., to find out some more details.

One of the main challenges of performing analysis upstream is incomplete models used in analysis. Normally the full physical layouts from which extractions are performed on interconnect do not yet exist. So how does one fill in the blanks to perform early analysis?

We want to follow this mantra of 85 ohms for PCIe, but it may not be so easy. Here’s a look at exactly what the spec says, and what we can do about it.

Following best design practices for controlling EMI will increase your chance of success in your next design. But, sometimes knowing what not to do is just as important.

Gustavo Blando, a Samtec signal integrity architect, recently presented “DC Block Capacitor Location (Does It Matter)?” at a Samtec geEEk and spEEk webinar. Here he presents a summary of some of his key points.

Mechanical needs and power limits are at odds with what is optimal for signal integrity. Having a metric that guides us to the sufficient SI choice rather than going for the optimal SI choice ultimately saves cost and decreases time to market. Read on for the details on Brandon Gore’s technique.

SIJ technical editor Eric Bogatin notes that there are some problems that occur over and over again across product families and applications. They have a handful of essential principles at their underlying root cause. In this blog, he explains that if we really understand these underlying principles, the root cause of the problems will be more apparent and their solutions closer to implement.

Recently, Cadence released its Clarity 3D Transient Solver for EMI simulation.  I caught up with Brad Griffin, product management group director for multi-physics system analysis in the Custom IC & PCB Group at Cadence to follow up for some more details.