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The continued progression to higher data rates puts increasing demands on the design of practical SerDes channels. At 112G-PAM4, the UI is only 17.86 ps, and signal transmission in the PCB must be highly optimized for loss, reflections, crosstalk, and power integrity. This article summarizes the key elements of a study that describes the signal-integrity and power-integrity design process and shows simulated SI and PI performance correlated to measured data as well as measured eye diagrams of a test board that uses a 112G-capable silicon and high-speed compression-mount cable connectors. 

Fans of a single, multifunction instrument that replaces a dozen benchtop instruments will be excited with the release from Liquid Instruments. Here’s a closer look at this multi-function instrument that combines the features of a bench top full of instruments, like a scope, a DMM, a function generator, a frequency response analyzer, a spectrum analyzer, and even an impedance analyzer, all into one USB controlled instrument. 

Eric Bogatin has a little fun with engineering in this tongue-in-cheek celebration of EE jargon; don’t forget your flux capacitor!

SIJ Technical Editor Eric Bogatin reviews two webinars: one on additively manufactured electronic circuits and one on automotive circuits.

The conventional PCB fabrication process for printed circuit boards is subtractive. Averatek recently introduced a new chemistry technology making semi additive circuit board fabrication more attractive for ultra fine line applications. SIJ’s technical editor, Eric Bogatin, takes a closer look.

Understanding a few simple power integrity (PI) fundamentals can go a long way towards increasing design margins when delivering power to high-speed digital loads. In this piece, Heidi Barnes provides some fundamental lessons on impedance.

In lieu of the given applications and industry efforts, many enterprises and industries are now viewing silicon photonics as an inevitable component for computers and monitoring devices. As the technology is touted to mature in the coming years, chances are that supercomputers would likely reach the exascale speed around human brain’s processing power at the neural level.

Stefaan Sercu, Samtec Signal Integrity R&D Engineer, recently presented “Impedance Corrected De-Embedding,” which discussed the advantages of impedance corrected de-embedding over standard 2X through de-embedding, here are some highlights of his talk.

There is an unsatisfied thirst by professional engineers to play with tools that give them a taste of the pro-level tools. Eric Bogatin makes his argument for low cost or “student level” equipment from tool vendors.

Recently, Ansys released its HFSS Mesh Fusion product for simulation of complex EM systems. Signal Integrity Journal (SIJ) followed up with Dr. Matthew Commens, Principal Product Manager, HF at Ansys, Inc., to find out some more details.