Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its 2024 issue. The magazine is available in print (by subscription and at select SI/PI/EMI events) and is also available as a technical eBook.

Subscribe to download the latest issue of Signal Integrity Journal featuring articles from industry experts including:

  • “Generative AI is in Your Future,” Eric Bogatin, Signal Integrity Journal
  • “The Road from 1 Gbps-NRZ to 224 Gbps-PAM4,” Augusto (Gus) Panella, Molex
  • “IEEE802.3dj Work on 200 Gbps per Lane and How Different FEC Options Affect SI,” Cathy Ye Liu, Broadcom
  • “PCB Laminate Anisotropy: The Impact on Advanced Via Modeling,” Bert Simonovich, Lamsim Enterprises
  • “Introducing an Upcoming IEEE Packaging Benchmark,” Istvan Novak and Gustavo Blando, Samtec; Shirin Farrahi, Kristoffer Skytte, and John Phillips, Cadence; Abe Hartman, Oracle; Ethan Koether, Amazon; and Mario Rotigni, STMicroelectronics
  • “Assessing the Accuracy of EM Simulation Tools,” Aakriti Srivastava, Micron; Eric Bogatin, Melinda Piket-May, Mohammed Hadi, and Aditya Rao, Univ. of CO
  • “Who Put that Inductor in My Capacitor?,” Will McCaffrey, Tyler Huddleston, Benjamin Dannan, and James Kuszewski, Northrop Grumman Mission Systems
  • “Worst-Case Bit-Pattern Generator for Eye Diagram Analysis of Non-LTI High-Speed Channels,” Majid Ahadi Dolatsara, Keysight Technologies
  • “DesignCon Returns to Celebrate Engineers and Innovation,” Suzanne Deffree, DesignCon

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