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TÜV SÜD is investing £1.65million in a 1,800m2 fully automated EMC and RF testing facility. Based at TÜV SÜD’s Hampshire headquarters, the latest facility’s three semi-anechoic EMC chambers will be in addition to five existing ones – significantly increasing test capacity.
Poorly designed interconnects can contribute to near field emissions, which is sometimes an indication of EMI failures, read on to see how to avoid failing an FCC test.
This first post in a new blog series, Extreme Measurements, introduces how an extreme measurement is defined. Find out how your extreme measurement story can end up on SIJ!
This article presents a quick and easy simulation model for filter performance analysis. The simulation model that the author built matches the test results quite well and it can serve as a useful and powerful tool for electronics design engineers.
Stefaan Sercu, Samtec Signal Integrity R&D Engineer, recently presented “Impedance Corrected De-Embedding,” which discussed the advantages of impedance corrected de-embedding over standard 2X through de-embedding, here are some highlights of his talk.
While many already had home lab setups for projects and exploring curiosities, the challenges of the global pandemic have driven many to ramp up their set ups and spend more time at their in-house benches. Over the years, Signal Integrity Journal has worked with many leading industry experts and stars in our field. Some have gamely agreed to play along with me and share images of their home labs. Enjoy the tour!
Recently, Ansys released its HFSS Mesh Fusion product for simulation of complex EM systems. Signal Integrity Journal (SIJ) followed up with Dr. Matthew Commens, Principal Product Manager, HF at Ansys, Inc., to find out some more details.
Following best design practices for controlling EMI will increase your chance of success in your next design. But, sometimes knowing what not to do is just as important.
Recently, Cadence released its Clarity 3D Transient Solver for EMI simulation. I caught up with Brad Griffin, product management group director for multi-physics system analysis in the Custom IC & PCB Group at Cadence to follow up for some more details.
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