Samtec, Inc., a global leader in high-performance interconnect solutions and a service leader in the industry, announces the expansion of its AcceleRate® HP product line with the release of 800-position APM6 and APF6 high-performance array connectors available in a low-profile 5 mm stack height.

Engineered for next-generation demands, the new AcceleRate HP connectors deliver exceptional signal integrity and density, supporting data rates up to 112 Gbps PAM4 on a 0.635 mm pitch. These connectors are optimized for high-throughput applications such as High-Performance Computing, Artificial Intelligence, storage, and networking.

Key features include:

• Protocol compatibility with PCIe® 6.0, CXL® 3.2, and 100 GbE
• 800-position configuration (8 rows × 100 positions) in a dense footprint of 68.62 mm × 18.20 mm (2.701 in. × 0.717 in.)
• 5 mm mated stack height, with a 10 mm version planned for Q2 2026
• 92.5  impedance
• 1.2 A max current rating (one pin powered per row), and 150 VAC (212 VDC) max voltage rating
• Open pin field array design for maximum grounding and routing flexibility

The APM6 and APF6 connectors utilize Samtec’s Solder Column Termination, enhancing structural integrity. This IPC Class 3 compliant method is ideal for dense, high-speed interconnects and offers superior solder joint reliability and excellent insertion loss and return loss performance.

“These new 800-position connectors represent a significant advancement in high-density, high-speed interconnect technology,” said Eric Mings, Samtec’s High-Speed Board-to-Board product manager. “They’re designed to meet the rigorous demands of today’s data-intensive systems while maintaining reliability.”

Samtec’s APM6 and APF6 products are available directly through Samtec or through authorized distribution partners. For more information, visit samtec.com/accelerateHP.