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Arteria and Nokia achieve a groundbreaking 1 Tbps optical transmission milestone between Lyon and Toulouse, leveraging VIAVI’s cutting-edge ONE LabPro™ solutions to ensure seamless performance and scalability for future-ready connectivity.
Sivers Semiconductors AB is in advanced discussions with its strategic customer, Ayar Labs, to partner on the next phase of engagement focused on manufacturing at scale to support deployment of Ayar labs in-package optical interconnect solutions.
Menlo Micro welcomed Under Secretary of Defense for Research and Engineering Heidi Shyu to Menlo Micro’s headquarters to discuss the widespread applications of its technology and the company’s continued work with the Department of Defense (DOD).
In this article, Steve Sandler presents several methods of measuring battery impedance, discussing the reasons for conducting such measurements and the challenges one might encounter along the way.
Available now in production quantities, Samtec AcceleRate Slim Direct-Attach Cable Assemblies target high-density applications in computing, datacom, AI, and shielded Gigabit Ethernet designs.
Cadence has achieved a significant milestone by designing and taping out its first-ever system chiplet, marking a groundbreaking advancement in chiplet realization capabilities.
Latest release combines Xpedition, Hyperlynx, and PADS Professional software through unified user experience with cloud connectivity and collaboration.
SLH/TLH PCB board-to-board connectors are part of Samtec’s Ultra Micro line of products that maximize overall space and offer reliable connections in high data rate rugged environments such as automotive, industrial IOT, robotics, and military and aerospace.
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