For Continuous, Lights-Out Digital Manufacturing of Electronics
July 24, 2019
Nano Dimension Ltd., introduced its new DragonFly Lights-Out Digital Manufacturing (LDM) printing technology, a comprehensive additive manufacturing platform for round-the-clock 3D printing of electronic circuitry.
Picotest.com, has released a new ‘FRA Bundle’ of signal injectors that enables Bode plots and PSRR (power supply rejection ratio) measurements for Keysight, Tektronix, Siglent, and Rohde & Schwarz oscilloscopes.
Cinch Connectivity Solutions, a Bel group company, announces new configurations of MIL-STD-1553 twinax cable assemblies, designed for military and commercial aerospace, ground vehicles, weapon systems, and space applications.
TE Connectivity (TE), introduced its new quad small form factor pluggable double density (QSFP-DD) connectors, cages and cable assemblies, which address next-generation data center needs by increasing density through an existing QSFP form factor to reach speeds up to 400 Gbps.
Integrated Pdk With a Complete Optical Transceiver Design Environment
July 10, 2019
TowerJazz, Cadence Design Systems, Inc., and Lumerical Inc., announced the availability of a complete custom design Silicon Photonics (SiPho) and Silicon Germanium (SiGe) integrated process design kit (PDK).