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Dell’Oro Group's recent report states the 3Q 2024 Mobile Core Network market continued its rollercoaster ride–up 12% year-over-year in 3Q 2024 after being down 15% year-over-year the previous quarter.
To provide higher efficiency and power density for telecom, industrial, and computing applications, Vishay Intertechnology, Inc. has introduced a new 150 V TrenchFET Gen V n-channel power MOSFET in the PowerPAK SO-8S (QFN 6x5) package.
Available now in production quantities, Samtec AcceleRate Slim Direct-Attach Cable Assemblies target high-density applications in computing, datacom, AI, and shielded Gigabit Ethernet designs.
The new device offers a fast quad serial peripheral interface and the highest density, radiation, and single-event effects performance available in a fully QML-qualified non-volatile memory for use with space-grade FPGAs and microprocessors.
The SDS7604A extends SIGLENT’s high-resolution mixed-signal analysis solutions to 6GHz with 20GSa/s sampling and a 15.6 in. touchscreen. With the ability to display up to 4 analog channels and, optionally, 16 digital channels, the SDS7604A is ideally suited for high performance mixed signal analysis.
Cadence has achieved a significant milestone by designing and taping out its first-ever system chiplet, marking a groundbreaking advancement in chiplet realization capabilities.
Akash Systems has signed a preliminary memorandum of terms with the U.S. Department of Commerce under the CHIPS and Science Act to receive over $68 million in direct funding
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