We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Cookie Policy.
The new R&S NRP170TWG(N) sensors from Rohde & Schwarz are used in general R&D for 6G mobile communications, novel sub-THz communications, sensing, and future automotive radar applications.
According to a recently published report from Dell’Oro Group, the Mobile Core Network market has become erratic, with the lowest growth rate since 4Q 2017.
With its robust design, integrated Swissbit powersafe PLP technology, and advanced security features, the N3202 is engineered to deliver unmatched reliability and endurance.
IDTechEx's research conducted in "Automotive Radar 2024-2044: Forecasts, Technologies, Applications" shows that, on average, 70% of new cars shipped in 2022 had a front-facing radar, while 30% had side radars.
Siglent’s first high-bandwidth, high-resolution oscilloscope SDS7000A series offers bandwidths up to 4 GHz, 12-bit resolution, and a sampling rate of 20 GSa/s, together with a matching high-bandwidth active differential probe SAP5000D.
Drawing on comprehensive reports covering both quantum technologies, IDTechEx separates hype from reality to compare the opportunities over the next decade.
After the successful introduction of the Digital Pulse Generator (DPG) option for its medium speed products, Spectrum Instrumentation has now added the same feature to its ultra-fast digitizers and Arbitrary Waveform Generators.
Infineon Technologies LLC Memory Solutions has announced the availability of its latest radiation-hardened asynchronous static RAMs designed with Infineon’s patented RADSTOP™ technology.
Ericsson’s next-generation RAN Compute portfolio includes four products with high and standard capacity variants, and with both enclosure and outdoor formats, to cater to varying site needs.
Keysight introduces the new Keysight i3070 Series 7i in-line test system, an automated in-circuit test system that enables manufacturers to economically meet the complex test demands of larger node count printed circuit board assembly.