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Liquid Instruments announced a 2023 Global Roadshow to share the latest trends in test and measurement, strategies to overcome test challenges with modern tools, and the benefits of software-defined instrumentation.
This latest version reinforces the Pulsonix commitment to delivering cutting-edge tools that empower engineers and designers to optimize their workflows, accelerate time to market, and achieve remarkable design excellence.
Primarius Technologies will showcase its DTCO-enabled EDA solutions powered by the latest generation SPICE and FastSPICE technologies at the Design Automation Conference.
Nearfield Instruments B.V. has launched AUDIRA™—the industry’s first and only in-line, non-destructive subsurface metrology system for advanced semiconductor manufacturing.
The supply of high-quality silicon carbide wafers from Wolfspeed will pave the way for Renesas to scale production of silicon carbide power semiconductors starting in 2025.
The design is built around a Teledyne e2v QLS1046-Space edge computing module that is configured by the radiation-hardened 64MByte Infineon SONOS based NOR Flash memory, enabling high performance space processing applications.
With the successful validation of the industry’s first protocol conformance test cases for 3GPP Rel. 17 NTN NB-IoT, Rohde & Schwarz and MediaTek accelerate adoption of non-terrestrial network-based IoT use cases spanning multiple sectors.
Data from Omdia and 5G Americas indicates strong penetration in the North American market, even as new 5G network buildouts are accelerating around the world.
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