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The acquisition allows Keysight to further expand its software prototyping capabilities into computer-aided engineering, enabling customers to accelerate time to market and lower operational costs while reducing their environmental footprint.
The new type of intelligent computing infrastructure is designed to address the computing power challenges associated with large-scale model computing.
YINCAE has announced the launch of its new innovative underfill material, which is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue.
Vishay Intertechnology, Inc. has introduced four new series of 200 V FRED Pt
ultrafast rectifiers in the low profile DFN3820A package with wettable flanks.
The new tester quickly performs all required electrical and signal integrity tests to ensure perfect cables every time, with low upfront capital equipment and operating costs.
With a focus on the future wave of microsystems innovation, DARPA has selected 11 organizations to begin work on the Next-Generation Microelectronics Manufacturing program.
Rohde & Schwarz and Zurich Instruments will present advanced test and measurement solutions for photonics at the LASER World of PHOTONICS tradeshow in Munich.
Nexperia announced a broadening of package options for its NextPower 80/100 V MOSFETs portfolio, previously only available in LFPAK56E, to now also include LFPAK56 and LFPAK88 packaging.
Keysight meets the need of design engineers with the first PCIe 6.0 Protocol Analyzer and PCIe 6.0 Protocol Exerciser. These cable-free solutions provide testing versatility and enable faster, more confident testing of PCIe 6.0 technology designs.
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