Industry News

news 9.17

Sabic to Expand Capacity in Asia for Noryl™ SA9000 Resin

Used Worldwide in Copper-Clad Laminates to Support 5G Infrastructure Growth

SABIC intends to boost production capacity for its specialty NORYL™ SA9000 resin to support rapid growth of high-performance printed circuit boards (PCBs) used in 5G base stations and high-speed servers. It is anticipated that this latest expansion, which builds on 2019 increases, will nearly double regional production in Asia and increase overall NORYL SA9000 resin production in Asia tenfold vs. 2018 levels. 


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hybridNETBOX – Multi-Channel AWG and Digitizer in One Box

The hybridNETBOX is an instrumentation platform for applications that require simultaneous signal generation and acquisition. Six models are available offering the choice of two, four, or eight pairs of matched AWG and digitizer channels, with output- and sampling-rates of 40, 80 and 125 Megasamples per second, and prices start from $12,930.


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cinapse

Cinch Connectivity Solutions Announces the Availability of CIN::APSE® Stacking Connector Jumpers and Assemblies in Distribution

Cinch Connectivity Solutions, a global leader in delivering reliable connectivity solutions announces CIN::APSE Stacking Connector Jumpers and Assemblies, that work in conjunction with standard 25 and 51 position stacking connectors and hardware with immediate availability through our distribution partners Digi-Key and Mouser and Newark.


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Xilinx

Xilinx Ships Multi-Function Telco Accelerator Card for Growing 5G O-RAN Virtual Baseband Unit Markets

Xilinx, Inc., announced the T1 Telco Accelerator Card for O-RAN distributed units (O-DUs) and virtual baseband units (vBBUs) in 5G networks. Built using the same field-proven Xilinx silicon and IP already being deployed in 5G networks, the T1 card is the only multi-function PCIe form factor card which performs both O-RAN fronthaul protocols and layer 1 offload. 


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