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GL Communications Inc. announced its insight into the High Speed OC3/12 and STM1/4 Analysis and Emulation Platform referred to as LightSpeed1000.

DesignCon highlighted the latest in high-speed digital design with keynotes covering the hot topics in the industry such as quantum computing, 5G, and artificial intelligence. Read this review of the event and exhibition.

USB Type-C Development Kit from Würth Elektronik eiSos is designed for those looking to take advantage of the vastly expanded range of options offered by USB Type-C and USB power delivery.

Efficient Power Conversion (EPC) is joining forces with Yole Développement (Yole) and SEMI to sponsor the first ever ‘GaN Con,’ a networking event covering the entire power GaN industry from manufacturers to end users.

Keysight Technologies, Inc. introduced the BenchVue Lab Management and Control solution, a software tool designed to simplify the configuration, monitoring and tracking of lab instruments while optimizing student learning.

Electronic Products, Inc. (EPI), a full-service, “powder-to-package” electronic device packaging designer and manufacturer, has announced increased capability to resolve various optoelectronic package challenges at Photonics West.

Pasternack has launched a new extended series of mmWave, removable,  edge launch, PCB connectors that are ideal for SERDES applications like high-speed networking, cloud servers and supercomputing. 

ANSYS Cloud aims to help businesses of all sizes to accelerate innovation and reduce time to market with the power of on-demand simulation and high-performance computing (HPC). ANSYS Cloud is designed to help engineers obtain high-fidelity simulation results and evaluate more design variations in less time and with a smaller information technology footprint.

SIGLENT Technologies has introduced a new flagship oscilloscope, the SIGLENT SDS5000X. Available with bandwidths of 350, 500, and 1 GHz, and featuring a maximum sample rate of 5 GS/s, the SDS5000X is fast enough to capture the most elusive measurements.

Teledyne LeCroy today announces support for PCI Express 5.0 physical layer testing with an advantage in calibration and test completion time, expanding on what is already an extensive set of PCI Express test solutions.