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Vishay Intertechnology, Inc. introduced a common-drain dual n-channel 60 V MOSFET in the compact, thermally enhanced PowerPAK^® 1212-8SCD package.

Vishay Intertechnology, Inc. introduced an IHDF edge-wound, through-hole inductor with rated current up to 72 A and saturation currents up to 230 A for industrial and military applications.

Keysight Technologies, Inc. announced that the company's early research and development in high-speed digital technology will enable 5G and IoT device ecosystems and it will help accelerate adoption of the recently released USB4 specification.

Tektronix introduced the industry’s first curve tracer in 1955 to display characteristic curves for vacuum tubes, followed over the years by models for testing transistors, diodes and other solid-state devices.

Altium launched the next version of its PCB design software: Altium Designer 20. Spanning more than two decades of electronic design, Altium Designer 20 aims to improve the design experience with a faster schematic editor, high-speed design and enhanced interactive router capabilities enabling faster board design.

Passive Plus, Inc.’s Capacitor Application Program (C.A.P.) helps engineers and designers select capacitors according to parameters such as cap value and frequency.

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M, claiming the world’s first multi-layer ceramic capacitor.

TE Connectivity (TE), is introducing its thermal bridge technology that can provide better thermal resistance over traditional thermal technologies such as gap pads or thermal pads.

EDI CON China 2020 taking place May 12-13, 2020 at the China National Convention Center (Beijing, China), is accepting nominations for the third annual EDI CON Product Innovation Awards.

Inphi has qualified TowerJazz for production of silicon photonics ICs for data center interconnects using TowerJazz’s PH18 silicon photonics foundry process.