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Bert Simonovich has published his new book, BERT SIMONOVICH’s SIGNAL & POWER INTEGRITY DESIGN NOTES: The Impact of PCB Fabrication and Material Properties on High-Speed Interconnect Modeling and Validation.

Ultra-low-impedance power distribution network (PDN) structures are difficult to correlate because the impedance of the device under test (DUT) can be comparable to artifacts introduced by probe coupling, probe landing, reference-plane placement, and electromagnetic solver configuration settings. This article shows some possible full-wave 3D simulation workflows for the IEEE TC-EDMS Benchmark Problem V, a four-via test case on 1 mm pitch in which the vias are shorted together on the L2 plane.  

Traditional space LDOs rely on silicon MOSFETs that suffer from radiation degradation. To solve this, Tony Marini from EPC Space highlights a revolutionary alternative using enhancement-mode Gallium Nitride (eGaN) HEMTs. Their unique material physics inherently resists Total Ionizing Dose (TID) effects without performance loss, ensuring exceptional parameter stability in harsh orbital environments.

Raytheon, an RTX (NYSE: RTX) business, has been awarded a phase one contract from the Defense Advanced Research Projects Agency (DARPA) to develop an all-optical processing system for the Photonic Integrated Circuit Architectures for Scalable System Objectives, or PICASSO, program.

Samtec, Inc. announces the release of its 10 mm stack height, AcceleRate® mP (UDM6, UDF6) combination signal pin and power blade connectors.

Yole Group launches a new market & technology analysis, The Printed Circuit Board (PCB) Industry 2026 report.

Modern AI and datacenter systems, equipped with complex multi-domain Power Distribution Networks (PDNs), grapple with substantial challenges stemming from large-signal crosstalk and ground bounce.

Just over six months before the event begins, there is already high demand for exhibition space at the EMV 2027.

Signal Integrity Journal is pleased to welcome Benoit Derat as its newest Technical Advisor.

According to Growth Market Report, the global Signal Integrity Monitoring for Vehicles market size reached USD 2.00 billion in 2025, driven by rapid advancements in automotive electronics and the increasing complexity of vehicle communication networks.