Industry News

Emerson Unveils AI-Ready Test Automation Platform at Annual NI Connect Conference

Wed, 13 May 2026 00:00:00 -0400

New AWG Function Accelerates Automated Testing Processes

Wed, 13 May 2026 00:00:00 -0400

Spectrum Instrumentation, a leading provider of more than 70 high-performance AWG products for all kinds of industries, now presents an additional AWG mode for automated testing environments.

HYPERLABS Expands Pacific Northwest Presence Through PSI Solutions Partnership

Tue, 12 May 2026 00:00:00 -0400

HYPERLABS is pleased to announce a new partnership with PSI Solutions, which will now represent HYPERLABS products throughout the Pacific Northwest territory.

IMS2026: The RF and Microwave Event Comes to Boston, June 7–12

Tue, 12 May 2026 00:00:00 -0400

The 2026 IEEE International MTT Symposia (IMS2026) convenes 7-12 June 2026 at the Thomas M. Menino Convention and Exhibition Center (MCEC), bringing 500+ exhibiting companies and more than 8,000 engineers, researchers, academics, and technology leaders from around the world to Boston.

Infineon’s new XHP™ 2 CoolSiC™ High-Power Modules Boost Efficiency and Power Density in High-Voltage Energy Systems

Mon, 11 May 2026 00:00:00 -0400

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its XHP™ 2 power module portfolio with new variants incorporating CoolSiC™ MOSFETs 2300 V, designed for high-voltage power systems.

Infineon Collaborates with d-Matrix to Optimize Performance and Power Efficiency for Interactive AI Inferencing

Sun, 10 May 2026 00:00:00 -0400

Infineon Technologies AG announced a collaboration with d-Matrix^®, a pioneer in highly interactive, low-latency AI inference compute for data centers.

Keysight PCIe 7.0 Receiver Stress Calibration at 128GT/s

Wed, 06 May 2026 00:00:00 -0400

Keysight Technologies, Inc. today announced a new PCIe® 7.0 Receiver (RX) Test application, extending its PCIe 7.0 portfolio to enable end-to-end transmitter and receiver validation.

Rohde & Schwarz Highlights New High‑Gain Antennas and Fast EMI Testing at APEMC 2026 in Kuala Lumpur

Tue, 05 May 2026 00:00:15 -0400

VIAVI Launches CyberFlood CF1000 Appliance for Next-Generation Validation of Multi-Terabit Security and AI Infrastructure

Tue, 05 May 2026 00:00:00 -0400

SiTime Boosts GPU Utilization in AI Data Centers with Elite 2 Super-TCXO

Mon, 04 May 2026 11:18:00 -0400

GlobalFoundries Accelerates Adoption of Co-Packaged Optics for Advanced AI Data Centers with SCALE Optical Module Solution

Mon, 04 May 2026 00:00:00 -0400

GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).

Indium Corporation Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain

Sun, 03 May 2026 00:00:00 -0400

Indium Corporation today announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.

OKI Develops 180-Layer 15 mm-Thick PCB Technologies for Next-Generation AI Semiconductor Testing Equipment

Thu, 30 Apr 2026 12:18:50 -0400

The OKI Group's printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (*1) mounted on AI semiconductors.

Skyworks Introduces Si86Px Digital Isolators with Integrated Power for Space‑Constrained Industrial Designs

Thu, 30 Apr 2026 00:00:00 -0400

Skyworks today announced the Si86Px family of digital isolators with integrated power, a compact solution that combines high‑performance digital isolation with an integrated isolated dc‑dc converter and matched miniature transformer.

New VITA 91 High Density VPX Backplanes from Pixus

Wed, 29 Apr 2026 00:00:00 -0400

Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced a new line of VITA 91 compliant backplanes.

New Samtec SMA Interconnects Capable of 26.5 GHz

Tue, 28 Apr 2026 00:00:00 -0400

Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new high-frequency, 50 Ohm impedance, SMA edge-mount board connector delivering repeatable, reliable performance through 26.5 GHz.

Signal Integrity IP Market To Reach USD 3.75 billion by 2033

Tue, 28 Apr 2026 00:00:00 -0400

The Signal Integrity IP market is quietly becoming one of the most influential enablers of next-generation electronics, particularly in the United States, where innovation in semiconductors, data centers, and AI hardware is accelerating at an unprecedented pace.

AT&S Advances Glass Core Substrates for AI, High-Performance Computing and Photonics

Fri, 24 Apr 2026 00:00:00 -0400

Microchip's Plug-In Timing Module Delivers Precise, Reliable Synchronization for Data Centers and 5G Networks to Meet the Demands of AI and Next-Generation Connectivity

Thu, 23 Apr 2026 00:00:00 -0400

Advanced Chip and Circuit Materials Introduces Negative and Near-zero CTE Materials

Mon, 20 Apr 2026 10:06:50 -0400

ACCM launched two new materials: Celeritas HM50 and Celeritas HM001.

Enabling High-Speed Swept-Source OCT with Advanced Data Acquisition

Mon, 20 Apr 2026 09:24:01 -0400

This article will explore the key role of digitizers in enabling state-of-the-art SSOCT systems and explain why Teledyne digitizers, including the ADQ32 and ADQ35, provide the performance, flexibility, and advanced features required by SS-OCT instrument developers striving to build next-generation imaging solutions.

Next-Generation SMD High-Voltage Mica Capacitors: CM-HVLP Power, Easy Integration, and Miniaturization

Mon, 20 Apr 2026 00:00:00 -0400

Amazon to Acquire Globalstar

Sun, 19 Apr 2026 00:00:49 -0400

Amazon.com, Inc. and Globalstar, Inc. announced that they have entered into a definitive merger agreement under which Amazon will acquire Globalstar, enabling Amazon Leo to add direct-to-device (D2D) services to its low Earth orbit satellite network and extend cellular coverage to customers beyond the reach of terrestrial networks.

Rohde & Schwarz to Host Power Electronics Online Conference “From Design to Validation” in May

Sun, 19 Apr 2026 00:00:27 -0400

Rohde & Schwarz will host the Power Electronics Online Conference “From Design to Validation” on May 5 and 6, 2026.

Sivers Semiconductors Collaborates With Jabil on Energy Efficient 1.6T Pluggable Optical Transceiver Module

Wed, 15 Apr 2026 08:51:13 -0400

Sivers Semiconductors AB announced a collaboration with Jabil, in which Jabil plans to develop a 1.6T LRO transceiver module using Sivers’ high-performance DFB lasers.

Samtec Cable Assemblies Test 224 Gbps PAM4

Wed, 15 Apr 2026 08:26:38 -0400

Samtec, Inc. announced the release of the BE71A Bulls Eye^® Phase & Amplitude Stable Test Assembly.

Advantest Announces Opening of Strategic Innovation Center

Tue, 14 Apr 2026 11:21:39 -0400

Advantest announced the opening of two Advantest Innovation Centers, one located on the company’s campus in San Jose, Calif., and another currently under construction in nearby Sunnyvale, Calif.

Orbital Sets Date for First Test Mission to Put AI Data Centers in LEO

Tue, 14 Apr 2026 08:01:01 -0400

Orbital is building and operating AI data centers in space, using solar power and radiative cooling to remove the energy and cooling constraints that limit terrestrial AI infrastructure.

EMC Testing for Data Centers Market to Reach USD 2.6B by 2033

Tue, 07 Apr 2026 09:10:39 -0400

According to Research Intelo, the global electromagnetic compatibility (EMC) testing for data centers market was valued at USD 1.2 billion in 2024 and is projected to reach USD 2.6 billion by 2033, expanding at a robust CAGR of 8.7 percent.

ACCM Celeritas™ SF1600 Delivers Zero-Skew for PCIe 7, 224 Gbps and Beyond

Mon, 06 Apr 2026 12:55:19 -0400

Advanced Chip & Circuit Materials, Inc. (ACCM) introduced Celeritas SF1600, a laminate and prepreg material that eliminates fiber weave skew at its root.