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Siemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.
Samtec announces that it will showcase high-performance interconnect solutions and enabling technologies that support data rates up to 448 Gbps and signals up to 130 GHz in booth #939 at DesignCon 2026.
Emerson announced an updated version of NI Nigel™ AI, the industry’s first test-optimized AI technology, as well as new capabilities across its NI LabVIEW+ Suite.
Rohde & Schwarz expands its portfolio of mid-range instruments with the launch of the R&S FPL1044 spectrum analyzer and a new 40 MHz real-time spectrum analysis (RTSA) option for the entire FPL family.
The collaboration validates Point2 Technology’s innovative e-Tube™ multi-terabit interconnects using Keysight's high-speed digital test solutions, addressing critical power and bandwidth challenges in AI infrastructure
Demand for High End Routers dramatically improved in 2025 following an 18% market correction in 2024 that was caused by oversupply combined with lower growth in network demand. The market recovery is being led by Core Router revenue, which is forecast to grow at an 11% CAGR through 2030.
Rolled out across the Boston area, the solution will scale services at the metro edge to enable high-bandwidth connectivity to be delivered straight to customer premises and campus locations.
Vishay Intertechnology, Inc. has introduced five new 1200 V MOSFET power modules designed to increase power efficiency for medium to high frequency applications in automotive, energy, industrial, and telecom systems.