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The OKI Group's printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (*1) mounted on AI semiconductors.

Skyworks today announced the Si86Px family of digital isolators with integrated power, a compact solution that combines high‑performance digital isolation with an integrated isolated dc‑dc converter and matched miniature transformer.

Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced a new line of VITA 91 compliant backplanes.

Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new high-frequency, 50 Ohm impedance, SMA edge-mount board connector delivering repeatable, reliable performance through 26.5 GHz.

The Signal Integrity IP market is quietly becoming one of the most influential enablers of next-generation electronics, particularly in the United States, where innovation in semiconductors, data centers, and AI hardware is accelerating at an unprecedented pace. 

Amazon.com, Inc. and Globalstar, Inc. announced that they have entered into a definitive merger agreement under which Amazon will acquire Globalstar, enabling Amazon Leo to add direct-to-device (D2D) services to its low Earth orbit satellite network and extend cellular coverage to customers beyond the reach of terrestrial networks.