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Emerson announced details of its annual NI Connect conference, being held May 12-14 at the Fort Worth Convention Center under the theme “Productivity Reimagined.”
Molex has completed the acquisition of Smiths Interconnect, marking a major milestone in Molex’s vision to enable technology that is transforming the future and improving people’s lives.
IBL Lab GmbH, the DAkkS-accredited EMC test laboratory of IB Lenhardt AG, has significantly expanded its high-field immunity testing capabilities with a substantial investment in a suite of high-power amplifier systems from Rohde & Schwarz.
Teledyne LeCroy introduces the CP1000, a 1000 Arms AC/DC current probe with DC to 1.5 MHz bandwidth, designed for accurate, high‑current measurements in motor drives, traction inverters, and high‑power systems.
Vishay Intertechnology, Inc. introduced a new space-grade, surface-mount common mode choke designed to provide EMI filtering and noise suppression in demanding space, aerospace and defense applications.
Keysight Technologies, Inc. announced it has achieved the industry’s first public interoperability demonstration of Ultra Ethernet Consortium (UEC) specification with Link Layer Retry (LLR) and Credit-Based Flow Control (CBFC) at 800GE line rate, in collaboration with Broadcom at OFC 2026.
Teledyne SP Devices recently announced a major advancement in high‑speed data acquisition through the combined capabilities of its high-speed ADQ3 data acquisition board family and the proprietary libads NVMe streaming library.
Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off.
Samtec, Inc announced production quantity availability of single-ended and mixed single-ended / differential pair signaling options using AcceleRate® Slim Cable Assemblies.
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