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Keysight has announced its new graphics double data rate 7 transmitter compliance solution, that accelerates validation of Joint Electron Device Engineering Council standards for graphics and AI applications. 

Building on the proven on-substrate and near-ASIC expertise of Molex, Impress provides a compression-based, substrate connector and mating cable assembly that supports data rates up to 224Gbps PAM-4 and beyond.

The Cadence^® ChipStack AI Super Agent is the world’s first agentic workflow for automating chip design and verification.

Keysight has introduced 3D Interconnect Designer, a new addition to its EDA portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications.

According to a recently published report from Dell’Oro Group, the MCN market revenues advanced 15% Y/Y in 2025. For the first time, the 5G MCN market accounted for 50% share of the total MCN market.

The Fraunhofer Institute for Photonic Microsystems addresses this challenge with a new 10G TSN endpoint IP Core, enabling deterministic real-time communication at data rates of up to 10 Gbit/s.

According to a recently published report from Dell’Oro Group, the Optical Transport equipment market grew 10% in 2025, driven by demand for data center interconnect. Revenue from direct purchases of WDM equipment for DCI grew nearly 40% in the year.

DesignCon has announced the keynote speakers for the 2026 edition.

With the launch of the ACS37017, Allegro completes a strategic expansion of its high-performance portfolio that now includes definitive, market-leading solutions for the three critical challenges in modern power electronics: speed, power density, and accuracy.

The new SKY535x2/x3 devices include an I2C interface, enabling differentiated features that include dual 1:n buffer mode, individual output enable control, and additional selectable output format options that include 800mV LVDS and HCSL with programmable swing.