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The roughness of copper foils has a detrimental effect on signal loss in PCBs. Therefore, reducing roughness is crucial in minimizing signal loss. Nevertheless, roughness is essential to ensure a good adherence between the prepreg and the copper foil. A compromise must be found between adherence and power integrity. This paper presents a novel approach to evaluate signal loss without assuming any specific roughness shape.    

Recogni Inc. has announced the availability of Pegasus, a PCIe card that allows Recogni’s Scorpio, the world’s first 1000 TOPS class inference solution for autonomous mobility, to be configured for any autonomous mobility application.

This paper demonstrates a step-by-step correlation methodology adapted for DSP-based PCIe Gen5 and Gen6 IBIS-AMI models where one can measure and directly correlate raw errors out of the DSP on a test setup that is based on the receiver stress eye methodology of the PCIe standard.

Dell’Oro Group has recently updated the "5G Workloads Moving to the Public Cloud" report, which projects HCPs to capture 9% of the 5G Standalone Workloads market in 2027.

As a gold sponsor, Rohde & Schwarz provides test equipment to the HORYZN and LEVITUM student initiatives of the Technical University of Munich (TUM) to help with drone development. 

Troubleshooting ESD in a compliance test lab can be time-consuming and expensive. Kenneth Wyatt provides practical advice on how to move the ESD troubleshooting process to your own workbench using simple ESD generators, simulators, and detectors. 

The vehicles of the future will be automated and networked to drive autonomously in road traffic and to relieve the drive, creating demand for new vehicle architectures and high-performance components.

PicoScope 7 boasts a range of enhanced features and functionality, making it the ideal choice for engineers and technicians looking for precise, reliable tools for their test and measurement needs.

Flex Power Modules has added a new part to their popular BMR492 series which now features a wide 36-75 V input range for telecom/PoE applications. 

In this article, Kella Knack outlines the stackup process, highlighting the importance of taking material issues, structural issues, and performance factors into account from the beginning of the design process. Knack discusses how providing fabricators with proper design documentation that includes precise information enables them to build to specification, ensuring correct functionality while avoiding additional costs for design.