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Keysight enhanced the x1149 Boundary Scan Analyzer with support for the new IEEE 1149.1-2013 and IEEE 1149.6-2015 standards, allowing advanced boundary scan testing beyond typical structural tests and significantly increasing test coverage on PCBs.
Featuring low 0.88 mm profile and wettable flanks, Automotive Grade 200 V, 400 V, and 600 V devices provide improved thermal performance and efficiency.
Teledyne e2v and Texas Instruments (TI) have collaborated on a new radiation-tolerant DDR4 modular platform to help satellite OEMs streamline their system development work.
In this overview of the principles of high-performance PCB layout, Joe Aguilar illustrates thermal design approaches, supplies a synopsis of the power delivery network (PDN), tells strategies for routing high currents with reduced impedance, and provides important considerations for designing effective decoupling capacitance.
Join Eric Bogatin, SIJ Technical Editor in his conversation with Amit Bahl, the PCB Guy discussing free PCB design tools, why the relationship you have with your fab shop is a critical ingredient.
Recent studies indicate that the industry is nearing the precipice where plated through hole via technology has reached a limit in supporting serial links with 28 GHz Nyquist frequency requirements. At DesignCon2021, a team from the Mayo Clinic presented this paper about their work to extend the “life” of conventional PCB technology.
With the recent introduction of the Averatek Semi-Additive Process (A-SAP) process, linewidths under 1 mil are possible using the same fabrication processing line as for traditional 4 mil wide lines. This opens up the possibility of using narrower traces in the BGA escape region than in long-path routing regions. However, using this routing architecture means the narrower traces in the BGA escape field are at a higher impedance than the wider, 50 ohm traces in the routing region. So, how long can these traces be before the impedance mismatch is a problem? The authors of this piece propose an analysis methodology to find out.
If you have designed a controlled impedance transmission line based on a PCB stack-up, how do you know if the PCB fabrication house or another vendor built your stack-up to meet your controlled impedance specification?
