Items Tagged with 'PCB'

This article covers the importance of proper calibration, measurement, and de-embedding to ensure that the final capacitor model is free of errors, allowing an accurate representation of the PDN used in simulation. While capacitor models may play a seemingly minor role in the overall system design, the impact of capacitor models can significantly impact the system design and, importantly, design sign-off.

Available freely to Samtec customers under NDA, SIBORG works with Ansys HFSS 3D Layout to generate, visualize, optimize, and develop PCB package and component break out regions.

Since woven glass PCB substrates are anisotropic, EDA design and modeling software hoping to advance AI and ML algorithms should have provisions to model anisotropic material, especially via transitions. In this article, Bert Simonovich discusses the importance of having an awareness of the test method used by CCL suppliers for accurate modeling and simulation. Simonovich covers how the use of out-of-plane Dk_z values instead of in-plane Dk_xy values for via modeling can cause misleading simulation results, which may result in reduced margins and potential compliance test failures when the design is built and tested. 

The expansion of the resin systems in laminates has been a source of reliability problems as the electronics industry has placed ever higher demands on those used in printed circuit boards. Suppliers of these resin systems have improved their resin systems to eliminate or minimize failures from expansion as the systems using the PCBs have been made more complex and subjected to ever harsher environments. Currently, the only technologies that still suffer failures from resin expansion with temperature are triple-high stacked blind vias, which Lee Ritchey explores in this article.

For power conversion in industrial and telecom applications, the Vishay Siliconix SiZF4800LDT increases power density and efficiency while enhancing thermal performance, reducing component counts, and simplifying designs.

Semiconductor signal conditioning and signal recovery innovations have extended data rates by managing allowable signal-to-noise ratio (SNR) at progressively higher Nyquist frequencies. We have experienced how each successive signaling technology increases the electro-mechanical design resolution needed to address the channel physics while respecting the SNR of the chips. These movements throughout the years have provided a baseline of traditional design goals that lead us to better understand today’s 224 Gbps-PAM4 physical layer requirements.

SierraConnect is a unique forum where you can get professional-grade answers to all your PCB questions.

Ventec Giga Solutions has announced it has been appointed as sales agent and distributor of specialist PCB lamination materials from Cardel.

In this installation of Engineering Nightmares, Robert Haller explores a keystone rule to keep in mind when troubleshooting signal integrity problems. Learn why signal integrity engineers should never perform a measurement or simulation without first anticipating what they expect to see.

Rogers Corporation will exhibit at PCB West in Santa Clara, Calif., (booth #201) highlighting some of its high performance circuit materials used in multilayer structures which include a family of thin laminates and bonding materials.