Items Tagged with 'PCB'

ARTICLES

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How to Stop Your Differential Vias from Leaking

Can common via structures transfer any data rate or are they limited with a defined bandwidth? If so, what limits its bandwidth? And what can be done when the bandwidth of the signal is greater than the bandwidth of the G-S-S-G structure? This technical feature from Dror Haviv explains.


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Current Distribution, Resistance, and Inductance in Power Connectors

Engineers who design and model power distribution networks require accurate component level models from high frequency down to DC.  Accurate modelling of power connectors can guarantee best power transfer and minimize power-induced noise.  In this paper, which won a DesignCon 2020 Best Paper Award, the authors analyze the frequency-dependent resistance and inductance of various power connectors as well as pin patterns.


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Return Current Transition Between Planes

Return current for a signal always finds a way to flow as close to the signal as possible, thus minimizing the magnetic energy stored in the loop defined by the signal and its return path. So, the return current path is the combination of conduction paths that together minimize the stored magnetic energy. Some elements of the return current path may be part of the design and other elements may be unintentional.


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Modeling PCB Interconnects with Geometry and Material Parameters Variations for 56 Gbps Links

Measured S-parameters and cross-sections of PCB interconnects are used in this paper to identify the parameters of electrical models suitable for statistical analysis of interconnects with manufacturing variations. The constructed models reproduce observed effects of geometry and material properties variations on the loss, delay, and impedance, and they are suitable for yield analysis of interconnects with up to 56 Gbps signals.


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SIJ EXECUTIVE INTERVIEW_

Executive Q&A: Jairo Guerrero, Molex

What are the greatest technical challenges facing connector designs for future high-speed deployments?Jairo Guerrero of Molex delves into the technical challenges for today’s connectors, the influence of applications such as automotive and data/telecom, and he gives an intriguing glimpse into the product development process at Molex.


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PCB Trace Current/Temperature Relationships and their Dependencies

The ability to analyze and predict the current/temperature effects of isolated traces is helpful, but the actual temperature of a trace may be different because of uncertainties in the actual trace thickness or board material thermal conductivity coefficient. This article traces the effort to see what PCB board parameters have the most impact in determining trace temperatures, followed by a look at related PCB design considerations. Read on to learn more.


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