Items Tagged with 'PCB'

Among various forms of signal degradation, skew is a key contributor to timing errors in systems operating at multi-gigabit data rates. An increasingly important factor at high speeds is material-induced skew due to local differences in dielectric constant arising from the PCB’s woven glass fabric reinforcement. This article aims to unpack the root causes of material-induced skew, particularly focusing on the glass weave effect, and explores mitigation techniques ranging from laminate selection to signal routing strategies.

SCHMID Group HAS announced the successful acquisition of two significant orders in the fast-growing field of PCB for AI server applications.

Yuriy Shlepnev of Simberian outlines the fundamental elements of DEA, examines the conditions for its accuracy, and highlights its growing importance in the future of interconnect design.

Eric Bogatin shares four webinars that provide valuable insights into PDN design for PCBs.

Many engineers struggle with getting their simulations and measurements to agree. Steve Sandler discusses calibration and de-embedding component measurements to help improve matching with the OMICRON Lab Bode 500.

Looking ahead to 2025, understanding the dynamics of the EV PCB market is crucial for stakeholders and enthusiasts alike.

EM simulators that are optimized for PCB PDN simulations provide an increased level of automation to enable the basics of DC IR Drop, electrothermal, and AC impedance for early detection of design issues. In this article, Heidi Barnes, Steve Sandler, and Benjamin Dannan examine why the ability to optimize a PDN for Z_Target with PCB parasitics in the frequency domain and then export to an end-to-end PI Digital Twin simulation for validation in the time domain should be standard practice for the PI engineer.

When designing circuit boards, a change made to one aspect of the design intended to resolve an issue can cause problems elsewhere. To reduce the problem of soldering on SMA connectors in an edge launch, a significant signal integrity problem has been introduced. This article explores best practices and provides insight into avoiding an inadvertent mistake.

Donald Telian discusses the nature of collaboration between signal integrity engineers and layout engineers, reflecting on how cooperation can be enhanced to promote teamwork, problem-solving, and productivity. 

Interconnect pioneers use premier electronics industry event to showcase wider digital cable solution capabilities.