Items Tagged with 'DesignCon 2025'

Traditional data-center physical layer architectures have undergone a significant transition due to the growth of east-west traffic within the data center for AI/ML cluster applications. This data growth has driven enormous demand for throughput in both chip-to-chip and chip-to-module channels. In this paper, which was awarded Best Paper Award at DesignCon 2025, the authors explore various physical layer design improvements through simulation and modeling tools.

This paper covers a study previously presented at DesignCon 2025 in which a novel SI-PI layout optimization methodology and via routing pattern were developed to address challenges and enable UCIe-xA64 connections to achieve 36 Gbps in Organic Interposer packaging. This summary provides an overview of the challenges, innovations, and methodologies presented in the study, offering solutions for high-speed multi-die system integration.

This paper, previously presented at DesignCon 2025, introduces a comprehensive framework for achieving 12.8 Gbps HBM3/4-to-SoC integration using innovative interposer technologies. This summary covers the key methodologies, findings, and implications of the study, focusing on practical solutions to SI-PI challenges in HBM interfaces.

Signal Edge Solutions is proud to announce that founder, CEO, and chief technologist Benjamin Dannan has won the prestigious DesignCon 2025 Engineer of the Year Award. 

Interconnect pioneers use premier electronics industry event to showcase wider digital cable solution capabilities.

Live demonstrations on high-speed signal integrity analysis, from initial evaluation to in-depth testing.

Innovative mating technique resolves the problems with intermittent power delivery and signal interruptions inherent in traditional MMCX connectors.

Advanced Chip and Circuit Materials, Inc. will be showing its high-performance circuit materials, including its Celeritas Series laminates and prepregs, at the DesignCon 2025 exhibition.

DesignCon gears up to celebrate its 30th anniversary this January with special events, an expo full of leading suppliers, and its highly regarded education.

Visitors can experience live demonstrations of cutting-edge innovations at DesignCon 2025 and test their skills in the Rohde & Schwarz "Are you a Genius?" Digital Debug Design Challenge.