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Silicon Labs has introduced a new family of low-power PCI Express® (PCIe®) Gen 1/2/3/4 clock buffers that provide ultra-low jitter clock distribution in 1.5 V and 1.8 V applications.

The new EMI receiver TDEMI® ULTRA from GAUSS INSTRUMENTS provides industry-leading features, such as a 685 MHz real-time bandwidth, fast receiver scanning and multi GHz real-time scanning up to 40 GHz. It is a multi-purpose instrument for a wide range of applications and due to its compact design, a 12V supply, and a weight of less than 10 kg it is a fitting tool for field testing or on-board testing applications.

Teledyne e2v is launching a complete GaN power solution based on technology from pSemi (formerly Peregrine Semiconductor) and GaN Systems. The solution features GaN FETs and the industry’s first rad-tolerant, half-bridge power driver for GaN high-reliability applications. The technology will be demonstrated at Satellite 2018 March 12-15 in the Teledyne Defense Electronics booth (#619).

Mitsubishi Electric US, Inc., Semiconductor and Device Division will exhibit for the first time at Applied Power Electronics Conference (APEC) in San Antonio, March 5-7, 2018.  The Semiconductor and Device Group will display its full lineup of power semiconductor products (formerly the Mitsubishi Products and Accessories Division of Powerex, Inc.) in booth #919.

Manufacturers of electronic equipment for Hi-Rel applications often struggle to meet stringent EMC and safety standards.  Knowles Precision Devices (KPD) has a range of EMI components, under the SYFER brand, that particularly appeal to designers in the medical implantable and space sectors as well as industrial, automotive, aerospace and telecom applications.

The current trend for many application requiring data converters is to get closer and closer to a full SDR (Software Defined Radio) system. While SDR architecture brings many benefits in terms of flexibility and SWaP-C (Size, Weight, Power and Cost) it often translates into higher bandwidth capability and is directly linked to the data converter sampling speed with the Shannon-Nyquist theorem.

Mentor, a Siemens business, today announced its new HyperLynx® printed circuit board (PCB) simulation technology for high-performance designs, now providing the industry’s first end-to-end fully automated serializer/deserializer (SerDes) channel validation solution.

At EMV 2018, Rohde & Schwarz will present its customized solutions for EMC measurements in all areas of product development, from the R&D phase to certification. A turnkey test system for certification testing in line with RED as well as complete systems for immunity measurements will also be on display.

Over 1000 pages long, the new “Passive Components 2018” catalog is now available from Würth Elektronik eiSos. The manufacturer of electronic and electromechanical components presents its broad and significantly extended range in the categories of EMC Components, Power Magnetics and Signal & Communications – some of which are AEC-Q200 qualified. All the products listed in the catalog are available from stock, also as free samples.

Tektronix, Inc., a worldwide provider of measurement solutions, today introduced EMCVu, a new all-in-one solution for EMI/EMC pre-compliance testing and troubleshooting. In today’s electronic design environment, about 50 percent of products fail electromagnetic compatibility (EMC) testing the first time.