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Istvan Novak, Principle Signal and Power Integrity Engineer at Samtec, Inc., was awarded DesignCon 2020’s Engineer of the Year at DesignCon, North America’s largest chip, board, and systems conference and exhibition.
DuPont Electronics & Imaging and SCHMID Group announced that they have entered into a nonexclusive joint development agreement to explore PCB plating applications to bring advanced changes to their global customers.
Renesas Electronics Corporation, announced low dropout (LDO) regulator targeting low-power FPGAs, DDR memory and other digital loads for spaceflight payload applications.
In support of the interoperability and reusability initiatives announced jointly by the US Army, Navy and Air Force a year ago, Elma Electronic is participating in the inaugural tri-service interoperability demonstration (TSOA-ID), hosted by Georgia Tech Research Institute (GTRI) in Atlanta, GA this month.
In collaboration with MathWorks, SeriaLink Systems announces a behavioral model of a high-speed ADC-based multi-standard SerDes developed with MATLAB and Simulink, a block diagram environment for simulation and model-based design of multidomain and embedded engineering systems.
Teledyne LeCroy, Inc. furthers its USB4 testing with the announcement of QualiPHY USB4 electrical transmitter (Tx) and receiver (Rx) compliance test software (QPHY-USB4-TX-RX) for its LabMaster 10 Zi-A and WaveMaster/SDA 8 Zi-B oscilloscopes used in conjunction with Anritsu’s Signal Quality Analyzer-R (SQA-R) MP1900A BERT.
Anritsu Company (DesignCon booth #837) will provide design engineers with a portfolio of signal integrity solutions at DesignCon 2020, held January 28-30 in Santa Clara, CA.
HUBER+SUHNER will display its latest solutions to meet the technological challenges of test and measurement applications at DesignCon 2020 in Santa Clara, California.
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