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Richardson RFPD, Inc. announced today the availability and full design support capabilities for a new evaluation board from GaN Systems Inc. and pSemi Corporation.

The key benefits of gallium nitride (GaN) are, amongst others, high power density, best-in-class efficiency and decreased system costs. Infineon Technologies AG is starting volume production for CoolGaN™ products by the end of 2018, the company announced during PCIM Europe.

At this week’s 2018 IEEE International Interconnect Technology Conference (IITC 2018), imec, will present 11 papers on advanced interconnects, ranging from extending Cu and Co damascene metallization, all the way to evaluating new alternatives such as Ru and graphene.

With the MAX22505 ±40V high-speed USB fault protector from Maxim Integrated Products, Inc., designers can now eliminate USB port damage from all faults, including ground potential differences, up to ±40V without the tradeoffs required by competing solutions. It protects data and power lines from industrial equipment powered at 24V_AC and 40V_DC, while also reducing solution size by more than 50% for industrial voltage applications.

Artech House today announced the publication of Intersystem EMC Analysis, Interference, and Solutions by recognized expert Uri Vered. This comprehensive new resource provides methods and tools for defining EMC requirements and techniques for performing predictions and calculations to achieve electromagnetic compatibility.

Automotive designers can significantly lower EMI and increase efficiency with the pin-compatible MAX20073 and MAX20074 buck converters from Maxim Integrated Products, Inc. The compact converters, which offer one of the lowest EMI performance for low-voltage point-of-load applications, which are ideal for automotive infotainment and ADAS applications.

TDK Corporation announced that today TDK acquired Faraday Semi LLC, a U.S.-based venture-backed company engaged in the design of advanced power semiconductor ICs. Faraday Semi is now a wholly owned subsidiary of TDK.

Silicon Labs has introduced a new family of low-power PCI Express® (PCIe®) Gen 1/2/3/4 clock buffers that provide ultra-low jitter clock distribution in 1.5 V and 1.8 V applications.

The new EMI receiver TDEMI® ULTRA from GAUSS INSTRUMENTS provides industry-leading features, such as a 685 MHz real-time bandwidth, fast receiver scanning and multi GHz real-time scanning up to 40 GHz. It is a multi-purpose instrument for a wide range of applications and due to its compact design, a 12V supply, and a weight of less than 10 kg it is a fitting tool for field testing or on-board testing applications.

Teledyne e2v is launching a complete GaN power solution based on technology from pSemi (formerly Peregrine Semiconductor) and GaN Systems. The solution features GaN FETs and the industry’s first rad-tolerant, half-bridge power driver for GaN high-reliability applications. The technology will be demonstrated at Satellite 2018 March 12-15 in the Teledyne Defense Electronics booth (#619).