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Silicon Labs has introduced a comprehensive portfolio of timing solutions that provide jitter performance to meet the latest generation PCI Express^® (PCIe) 5.0 specification with significant design margin.

Kyocera Corporation and Vicor Corporation will collaborate on next-generation power-on-package solutions to maximize performance and minimize time-to-market for emerging processor technologies.

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments released the Keysight 2019 Electronic Product Design report, which reveals that data sharing enabled by an integrated product development solution would significantly improve time-to-market across the entire product development workflow.

Introspect Technology, released its SV4D Direct Attach MIPI Test Module. The SV4D is a high-performance, compact test module that enables at-speed production testing for MIPI® Alliance C-PHY℠ or D-PHY℠ transmitter or receiver interfaces.

Teledyne LeCroy introduced its WaveRunner 9000 Series mixed-signal oscilloscopes. The WaveRunner 9000 Series offers the deepest toolbox and the most complete collection of serial data debug and validation solutions, making it well suited for embedded system, automotive, and EMC/EMI test applications.

On April 2, EDI CON China 2019 announced the winners and presented the trophies to company representatives in its second annual EDI CON CHINA Product Innovation Awards.

Cadence Design Systems, Inc.  entered the system analysis and design market with the announcement of the Cadence^® Clarity 3D Solver, which delivers gold-standard accuracy with up to 10X faster simulation performance and unbounded capacity compared to legacy field solver technology.

Richardson RFPD, Inc. announced the availability and full design support capabilities for a new family of 650 V GaN E-HEMTs from GaN Systems Inc.

Agency for Science, Technology and Research's (A*STAR) Institute of Microelectronics (IME) and Soitec (Euronext Paris), announce the launch of a joint program to develop and integrate a new layer transfer process within advanced wafer level multi-chip packaging techniques.