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Indium Corporation today announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.

The OKI Group's printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (*1) mounted on AI semiconductors.

Skyworks today announced the Si86Px family of digital isolators with integrated power, a compact solution that combines high‑performance digital isolation with an integrated isolated dc‑dc converter and matched miniature transformer.

Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced a new line of VITA 91 compliant backplanes.

Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new high-frequency, 50 Ohm impedance, SMA edge-mount board connector delivering repeatable, reliable performance through 26.5 GHz.

The Signal Integrity IP market is quietly becoming one of the most influential enablers of next-generation electronics, particularly in the United States, where innovation in semiconductors, data centers, and AI hardware is accelerating at an unprecedented pace. 

ACCM launched two new materials: Celeritas HM50 and Celeritas HM001.