Industry News

EDI CON China

EDI CON China 2018 Announces Keynote Speakers

EDI CON China 2018, a conference and exhibition that brings together engineers working on high-frequency analog and high speed digital designs, taking place March 20-22, 2018 at the China National Convention Center, announces the lineup for its plenary keynote sessions at this year’s event.


Read More

Rogers Corporation to Showcase Specialty Materials for Power Electronics Applications at APEC 2018

Rogers Corporation will be showing its specialty materials for Power Electronics Applications with examples of its range of laminated busbar solutions including capacitor-busbar assemblies, curamik® substrates, 92ML™ thermally conductive PCB materials and HeatSORB™ phase change material at the upcoming APEC 2018 conference and exhibition (http://ww.apec-conf.org).


Read More

Significant Savings in PCBA Test

Everett Charles Technologies offers Standard Mechanical Bench Top Cassette System

Everett Charles Technologies’ (ECT) Mechanical Bench Top Cassette System in one standard size is the entry level bench top test fixture that allows interchangeable cassettes to be used to further reduce fixturing costs. Mechanical Bench Top Cassette System enables reliable spring test probe access to small and medium sized PCBAs. Its cleaver design offers an advanced set of features as standard.


Read More

Altair Expands Thermal Capabilities for Electronics; Acquires TES International’s Software, Hires Key Technologist

ElectroFlo CFD Software broadens HyperWorks® platform capabilities for electronics design

Altair (ALTR), developer of the HyperWorks computer-aided engineering software suite, has acquired Michigan-based TES International’s technology, intellectual property, and other assets.  TES was founded in 1994 to service the “electronics cooling” market, and provides cross-industry software solutions for thermal design and packaging, custom programming, general heat transfer, stress and vibration analysis, and computational fluid dynamics (CFD).


Read More