HyperLynx Thermal

HyperLynx® Thermal analyzes board-level thermal conditions on placed, partially routed, or fully routed PCBs. It simulates conduction, convection and radiation, and produces temperature profiles, gradients, and excess temperature maps, resolving board and component overheating early in the design process.

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HyperLynx Fast 3D Solver

HyperLynx® Fast 3D Solver enables efficient, full package model creation with multi-processing for faster turnaround time. It is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model generation while accounting for skin effect impact on resistance and inductance.

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HyperLynx Full-Wave Solver

HyperLynx® Full-Wave Solver delivers unprecedented speed and capacity, through accelerated boundary element technology, while preserving gold-standard Maxwell accuracy. Achieve greater accuracy and fewer re-spins, even on the most complex structures.

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HyperLynx PI

Identify potential power integrity distribution issues that can interfere with board design logic, and investigate and validate solutions in an easy-to-use, “what-if” environment with HyperLynx® PI.

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