Mentor, a Siemens business, today announced its new HyperLynx® printed circuit board (PCB) simulation technology for high-performance designs, now providing the industry’s first end-to-end fully automated serializer/deserializer (SerDes) channel validation solution.
HyperLynx® Thermal analyzes board-level thermal conditions on placed, partially routed, or fully routed PCBs. It simulates conduction, convection and radiation, and produces temperature profiles, gradients, and excess temperature maps, resolving board and component overheating early in the design process.
HyperLynx® Fast 3D Solver enables efficient, full package model creation with multi-processing for faster turnaround time. It is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model generation while accounting for skin effect impact on resistance and inductance.
HyperLynx® Full-Wave Solver delivers unprecedented speed and capacity, through accelerated boundary element technology, while preserving gold-standard Maxwell accuracy. Achieve greater accuracy and fewer re-spins, even on the most complex structures.
The authors analyze the computational procedure specified for Channel Operation Margin (COM) and compare it to traditional statistical eye/BER analysis and propose a modification to the COM procedure that eliminates these problems without considerable work increase.