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The Call for Abstracts for EDI CON USA 2018 has opened; selected papers will be presented at EDI CON USA 2018, held October 17-18, 2018 at the Santa Clara Convention Center, Santa Clara, Calif.

Carlisle Interconnect Technologies (CarlisleIT), a division of Carlisle Companies (CSL), is exhibiting at the upcoming DesignCon 2018 Expo in Santa Clara, CA, Jan. 31–Feb. 1, 2018 in booth #648. CarlisleIT is introducing an updated CoreHC™ interconnect solution and brand-new Card Edge Connectors contact system as part of its integrated line of high-performance microwave cables and precision RF and high-speed digital connectors for Test & Measurement applications.

IPC — Association Connecting Electronics Industries® announced today the December 2017 findings from its North American Printed Circuit Board (PCB) Statistical Program. Positive year-over-year shipment and order growth continued in December.

Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2018 in Santa Clara, CA, January 31-February 1, 2018.  Molex, booth 633, will feature next-generation technologies designed to meet rising data speeds and bandwidth in demanding networking and high-performance computing applications.

TE Connectivity, today announced that it will showcase Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector.

Keysight Technologies will exhibit its latest high-speed digital solutions at DesignCon 2018. Keysight's technical experts and application engineers will demonstrate the most advanced design and test solutions, developed for solving today's most difficult high-speed digital measurement challenges.