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Richardson RFPD, Inc. announced today the availability and full design support capabilities for a new insulated metal substrate (IMS) evaluation platform from GaN Systems Inc.

TDK Corporation presents an extremely compact EPCOS film capacitor for the DC link of inverters. With dimensions of just 40 mm x 58 mm (d x l) it offers a rated voltage of 350 V DC and a capacitance of 65 μF.

Rogers Corporation is pleased to introduce RO4460G2, low loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials.

EDI CON China 2018, taking place March 20-22, 2018 at the China National Convention Center in Beijing, announces the finalists in the first EDI CON Innovation Awards.

Richardson RFPD, Inc. announced today the availability and full design support capabilities for two new series of DC/DC converters from RECOM Power, Inc. (RECOM). 

Saelig Company, Inc. has introduced the Euroquartz QuikXO HC_JF series of switchable crystal oscillators that can provide four different preselected frequencies.

EDI CON USA, the industry event that brings together RF/microwave and high speed digital design engineers and system integrators, is happy to announce its technical program co-chairs for the 2018 USA event.

Intel today announced it has begun shipping its Intel® Stratix® 10 TX FPGAs, the only field programmable gate array (FPGA) with 58G PAM4 transceiver technology. By integrating the FPGA with 58G PAM4 technology, Intel Stratix 10 TX FPGAs can double the transceiver bandwidth performance.