Rogers Corporation will be showing its specialty materials for Power Electronics Applications with examples of its range of laminated busbar solutions including capacitor-busbar assemblies, curamik® substrates, 92ML™ thermally conductive PCB materials and HeatSORB™ phase change material at the upcoming APEC 2018 conference and exhibition (http://ww.apec-conf.org).  

APEC, the annual allied power electronics conference, will be held from March 5 thru March 7th at the Henry B. Gonzalez Convention Center, San Antonio, Texas. Rogers will be exhibiting at Booth #728.

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Visitors to Rogers’ booth will have the chance to learn more about the range of ROLINX® laminated and powder coated busbar solutions and ROLINX CapPerformance capacitor-busbar assemblies and their outstanding high current and low inductance capability solution (www.rolinx.com).

ROLINX laminated busbars offer low inductance, compactness, a customized design and, in combination with capacitors, extremely low inductance and high power density capabilities. These enhanced busbar assemblies enable smaller, lighter electronic designs with higher current handling capabilities in support of a wide range of applications, from automotive electronics to solar-powered and wind-powered systems.

Visitors to the Rogers booth can also learn more about curamik substrates designed for high-demand applications. The basis of the substrate is a ceramic isolator to which pure copper is applied. The result is ceramic substrates with high heat conductivity and great heat capacity and heat spreading provided by the thick copper layer.  These high performance substrates are well-suited for power electronics applications.

In addition, Rogers will be showcasing the 92ML Series thermally conductive PCB materials.  These materials, which are available as copper clad laminate, IMS, and prepreg, effectively reduce the operating temperature of PCB-mounted power ICs for improved reliability and optimized performance using no additional materials, saving designers weight and space.  The thermal conductivity of the 92ML materials is 2 W/(m.K) in the z-axis and 3.5 W/(m.K) in-plane. The materials feature outstanding mechanical and thermal reliability, with Tg of 160 ⁰C paired with low z-axis CTE of 22 ppm/⁰C, as well as UL MOT of 150 ⁰C.  Designing with the 92ML Series PCB materials will help keep circuits cool!

Visitors can also learn about HeatSORB™ proprietary phase change material (patent pending) that addresses thermal management issues by capturing heat and delaying temperature ramps, allowing devices to remain cooler.

Become a Member of the Design Support Hub.

Rogers brings its more than 40 years of experience with Power Electronics Solutions together in a handy online resource that is available 24/7. The Power Electronics Solutions (PES) Design Support Hub features complete technical information on ROLINX busbars, capacitor busbar assemblies and curamik ceramic substrates, a library of technical papers on product design and problem solving and helpful videos on products and power distribution topics. Registration for access is quick and free of charge. The Design Support Hub helps design engineers to increase power, manage heat, and ensure the quality and reliability of their devices for optimal new product design (https:www.rogerscorp.com/designhub).