Industry News

Rogers Bondply

Rogers Corporation Introduces RO4460G2™ Bondply

Rogers Corporation is pleased to introduce RO4460G2, low loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials.


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EDI CON USA

EDI CON USA 2018 Announces Technical Program Chairs

Jin Bains and Ransom Stephens join the team to shape this year’s conference in Santa Clara, Calif.

EDI CON USA, the industry event that brings together RF/microwave and high speed digital design engineers and system integrators, is happy to announce its technical program co-chairs for the 2018 USA event.


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EDI CON China

EDI CON China 2018 Announces Keynote Speakers

EDI CON China 2018, a conference and exhibition that brings together engineers working on high-frequency analog and high speed digital designs, taking place March 20-22, 2018 at the China National Convention Center, announces the lineup for its plenary keynote sessions at this year’s event.


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