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This article presents a quick and easy simulation model for filter performance analysis. The simulation model that the author built matches the test results quite well and it can serve as a useful and powerful tool for electronics design engineers.
Stefaan Sercu, Samtec Signal Integrity R&D Engineer, recently presented “Impedance Corrected De-Embedding,” which discussed the advantages of impedance corrected de-embedding over standard 2X through de-embedding, here are some highlights of his talk.
While many already had home lab setups for projects and exploring curiosities, the challenges of the global pandemic have driven many to ramp up their set ups and spend more time at their in-house benches. Over the years, Signal Integrity Journal has worked with many leading industry experts and stars in our field. Some have gamely agreed to play along with me and share images of their home labs. Enjoy the tour!
Recently, Ansys released its HFSS Mesh Fusion product for simulation of complex EM systems. Signal Integrity Journal (SIJ) followed up with Dr. Matthew Commens, Principal Product Manager, HF at Ansys, Inc., to find out some more details.
Following best design practices for controlling EMI will increase your chance of success in your next design. But, sometimes knowing what not to do is just as important.
Recently, Cadence released its Clarity 3D Transient Solver for EMI simulation. I caught up with Brad Griffin, product management group director for multi-physics system analysis in the Custom IC & PCB Group at Cadence to follow up for some more details.
The extension of operating frequencies in the mmWave region and beyond is the story of wireless development for the next thirty years. Understanding the resulting challenges and improving the state-of-the-art is a key driver for the EMC and wireless Industries. This article takes a look at some of the fundamentals of mmWave, including signal propagation, available spectrum, and challenges and issues facing EMC.
Richardson Electronics, Ltd. strengthens its RF offering with Masach Tech™ EMI/RFI shields. These rigid, very planar parts are designed for reflow solder and have a removable lid to allow for much easier component troubleshooting and repair.
Can common via structures transfer any data rate or are they limited with a defined bandwidth? If so, what limits its bandwidth? And what can be done when the bandwidth of the signal is greater than the bandwidth of the G-S-S-G structure? This technical feature from Dror Haviv explains.
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