Cadence

Next-generation wireless communication and radar systems demand increased RF power within a smaller footprint to meet performance and size requirements. This paper discusses the impact of operating temperature on RF device performance and reliability and presents a thermal analysis solution based on FEA that is integrated within a dedicated RF component design platform.

This white paper highlights Sigrity X features for SI and PI analysis that enable designers to cut design respins and meet short time-to-market windows with confidence. 

This white paper demonstrates a high-current motor controlling PCB solution for the automotive industry that utilizes the Celsius solver to optimize the PCB design, as well as electrothermal co-simulation to uncover thermal issues in the leadframe package.

This white paper describes the Cadence® Clarity™ 3D Solver Cloud, a straightforward, secure, and cost-effective approach to executing 3D EM simulations using the robust compute resources available in the cloud.

This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence® Celsius™ Thermal Solver enables designers to develop strategies to mitigate these impacts.

This white paper highlights the features in Cadence® Sigrity™ X signal and power integrity (SI/PI) solutions for system-level SI and PI analysis. Read on for more.