Featured Stories | Signal Integrity Journal

Via Stubs – Are They all Bad?

March 10, 2017

We worry about via stubs in high-speed designs because they cause unwanted resonant frequency nulls which appear in the insertion loss plot (IL) of the channel. But are all via stubs bad? Well, as with most answers relating to signal integrity, “It depends.”

Voltage diagram of a supply rail illustrating the major design parameters.

The Evergreen Question about PDN: Charge Delivery Time or Impedance

March 9, 2017

Istvan Novak

Here's how to find a balance between delivering and supplying enough charge to the load in a timely fashion versus achieving a required impedance target

Measuring Glass Weave Skew and the Identification of an Important Hidden Variable Artifact

March 2, 2017

Eric Bogatin

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This article summarizes a technique developed at the University of Colorado, Boulder (CU), and introduced at DesignCon 2017 to measure the magnitude of the glass weave skew effect and an observation of an important hidden variable which might explain why there is so much confusion about this effect in the industry.

Accurate Statistical-Based DDR4 Margin Estimation Using SSN Induced Jitter Model

March 1, 2017

HeeSoo LEE, Cindy Cui, Heidi Barnes, and Luis Boluna,

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Here's a proposed method that improves the accuracy of DDR4 statistical simulation by using the mask correction factor. It presents a validated correlation between measured and simulated data to show that this methodology can be effectively used for DDR4 design

Speaking Opportunities on Power Integrity and Signal Integrity

February 8, 2017

Janine Love

Last week, DesignCon 2017 put on a show for high-speed engineers that included a conference as well as an exhibition. The conference included many opportunities for speaking, and more will be happening later this year at the EDI CON USA event in Boston, September 11-13.

EDI CON USA Announces 2017 Event: Save the Date!

November 30, 2016

EDI CON

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Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products.

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