January 28, 2020

Sponsored by: EMV



Modeling PCB Interconnects with Geometry and Material Parameters Variations for 56 Gbps Links

By Alex Manukovsky and Yuriy Shlepnev

Measured S-parameters and cross-sections of PCB interconnects are used in this paper to identify the parameters of electrical models suitable for statistical analysis of interconnects with manufacturing variations. The constructed models reproduce observed effects of geometry and material properties variations on the loss, delay, and impedance, and they are suitable for yield analysis of interconnects with up to 56 Gbps signals.


4 Things to Look For When Interpreting Standard Requirements

By Craig Fanning

Being on several standards committees, I get a lot of questions about how to interpret the information provided in standards and specifications. Sometimes this is from a colleague who is thoroughly reviewing a specification in preparation for a quality audit. As a result of the thorough standard review and the possibility of being assessed a “deficiency” during the audit, they become overly concerned about all parts of the standard. Read on to discover more.

News Feature1

Teledyne LeCroy Launches T3 VNA

Teledyne LeCroy announced the further development of its Teledyne Test Tools (T3)-branded portfolio of test equipment with the launch of the T3VNA1500 vector network analyzer (VNA). This product launch enhances the existing T3 test equipment portfolio, adding to the affordable selection of test equipment that engineers, developers and schools can use to assemble a well-equipped test bench efficiently, reliably and within budget.

News Feature2

Rogers Corporation to Highlight High-Speed Digital Laminates & Next Generation Thin Materials for Millimeter Wave Multilayer Designs at DesignCon 2020

Rogers Corporation will exhibit at DesignCon in Santa Clara, CA (at booth #421) Jan 29-30 highlighting some of its high- performance circuit materials used in multilayer structures which include a family of thin laminates, bonding materials, and sheeted copper foil options.


SIJ January 2020 Issue


The SIJ January 2020 Issue is Here!

Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its January 2020 issue. The January magazine is available in print (by subscription and at select SI/PI/EMI events) and is also available as a technical eBook.

Don't miss out on the latest... download the eBook today!

DesignCon 2020

Win a Library at DesignCon!

By Janine Love

Here’s what you need to do to enter to win copies of 9 books to round out your SI/PI library—one is out of print and one is hot off the press.

Signal Integrity Journal will be at DesignCon 2020 in Booth T16, sharing our latest print edition of the magazine. Stop by and pick up a copy, perhaps meet one of our illustrious editorial advisory board members. Scan to join our community and enter for a chance to win this impressive library of PI/SI/EMC/EMI books. See you in Santa Clara!!



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