Rogers Corporation will exhibit at DesignCon in Santa Clara, CA (at booth #421) highlighting some of its high performance circuit materials used in multilayer structures which include a family of thin laminates, bonding materials, and sheeted copper foil options.
Visitors to Rogers’ booth will learn more about:
XtremeSpeed RO1200 Laminates
XtremeSpeed RO1200 high speed, extremely low loss laminates, with a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 @10 GHz, provide signal integrity, reduced signal skew, and reduced cross-talk. Combined with thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, these laminates are well suited for the most demanding high layer count applications.
As channel speeds rise to 112Gbps and beyond, hardware designers need high performance circuit materials with electrical properties for applications like network infrastructure, high performance computing, and test & measurement. XtremeSpeed RO1200 circuit materials are engineered to meet the electrical and thermal/mechanical demands of high-speed designs and enable system designers the flexibility to design edge systems that maximize data throughput and minimize latency in performance demanding applications.
RO4000® Products for Multilayer Structures:
Next generation products designed to meet the existing and emerging needs of advanced millimeter wave multilayer designs. RO4835T laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and they complement RO4835 laminates when thinner cores are needed.
RO4450T 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials were designed to complement RO4835T laminates and the existing RO4000 laminate family, and come in 2.5, 3, 3.5, 4, 4.5, 5 or 6 mil thicknesses.
RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z-axis expansion for plated through-hole are compatible with standard epoxy/glass (FR-4) processes. These materials are for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminates and RO4450T bondplys have the UL 94 V-0 flame retardant are compatible with lead-free processes.
Lastly, CU4000 and CU4000 LoPro® Foils are sheeted foil options for designers looking for foil lamination provide good outer layer adhesion when used with RO4000 products.
RO3003G2 high frequency laminates build on Rogers’ RO3003 platform to provide designers with improved insertion loss and reduced Dk variation. The combination of Rogers’ resin and filler content along with the introduction of very low-profile ED copper translates to Dk of 3.00 @ 10 GHz (clamped stripline method) and 3.07 @ 77 GHz (microstrip differential phase length method). RO3003G2 laminates also show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method.
CLTE-MW laminates are reinforced with spread glass, which along with a high filler loading help minimize the high frequency glass weave effects on electromagnetic wave propagation. The woven glass reinforcement also provides excellent dimensional stability. Other key features of the laminate include low z-axis CTE (30ppm/°C) for excellent plated through hole reliability, a low loss tangent of 0.0015 at 10 GHz to enable low loss designs, and low moisture absorption of 0.03% to ensure stable performance in a range of operating environments. Thermal conductivity of 0.42 W/(m.K) enables heat dissipation in aggressive designs along with a high dielectric strength of 630 V/mil to ensure good z-axis insulation between conductor layers. The UL 94 V-0 flammability rating enables the use of CLTE-MW laminates in commercial applications including Amplifiers, Antennas, Baluns, Couplers and Filters.
Technical Conference Presentation:
On the technical conference side, Al Horn, Rogers Research Fellow, will participate in a panel discussion “Next Generation Materials for High Speed Digital Design” on Jan. 29th, from 3:45 – 5:00 p.m.
For more information, visit www.rogerscorp.com.