January 14, 2020

Sponsored by: Rohde & Schwarz NA

Rohde & Schwarz NA


Point to Multipoint Non-contact Interconnect Bus: Necessity is the Mother of Invention

By Bert Simonovich

Before the high-speed serializer/deserializer (SerDes) technology we know and love today, the only way to interconnect circuit cards in a backplane was to use wide parallel busses to interconnect them. Bert reminisces about the problems and innovations that led to the invention of the point to multipoint non-contact interconnect bus. Learn more.

News Feature1

Anritsu Enhances BERTWave MP2110A Sampling Oscilloscope with Built-in 53-Gbaud Clock Recovery Unit

Anritsu Company introduces a clock recovery unit (CRU) option for its BERTWave MP2110A that supports trigger clock generation from a 53-Gbaud PAM4 optical signal. When combined with existing oscilloscope functionality, the 53-Gbaud CRU allows the MP2110A to serve as a solution that can cost-effectively and efficiently evaluate various PAM4 optical modules.

News Feature2

TE Connectivity Introduces M8/M12 Cable Assemblies with Fieldbus Protocols

TE Connectivity (TE), is introducing an M8/M12 cable assembly solution for Fieldbus data communications, complementing its existing sensor/actuator cable assembly solutions for industrial networks. The A and B-coded M8/M12 cable assemblies comply with Profibus, DeviceNet and CC-link protocols, offering multiple options for a variety of needs.



Samtec Inc.


Connector Solution To Achieve 112 Gbps PMA4
Data Rates

Sponsored By Samtec Inc.

As data rate requirements approach 112 Gbps PAM4, developers are challenged with increasing throughput, scalability, density, power consumption, signal integrity, time-to-market, and of course cost. System designers are now using Samtec Flyover® to extend signal reach and density to achieve next gen speeds. Watch the video to discover more.

EDI CON Online

Watch On-Demand: Test Fixture De-embedding for PCB Characterization and Material Extraction

Didn't get a chance to attend EDI CON Online in September? This SI/PI Technical Session presented by James Drewniak covered de-embedding using a 2X thru approach, and suitable test fixture development for successful de-embedding to high frequencies will be discussed. The specific application presented will be PCB material characterization.

Register now for this on-demand session, it's FREE.

Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience.
Browse webinars here.



EDI CON China 2020

EDI CON China Deadline Extended to January 20, Submit Your Abstract Today!

Due to popular request we’ve extended our deadline to submit. Are you interested to meet with an engaged audience that wants to learn? The Call for Abstracts for EDI CON CHINA 2020 is still open for 30-minute technical session talks. Submit your English or Chinese language proposal by January 20, 2020. Then, the Technical Advisory Committee evaluates abstracts on quality, relevance, impact, and originality. Give us a detailed idea of what your plan is, and we will let you know if your abstract gets selected!

Submit Your Abstract



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